Teledyne Technologies-posted 2 days ago
Full-time • Entry Level
Goleta, CA

About the job We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins. Job Summary: As part of the uncooled detector (focal plane array) research and development team, the successful candidate will have responsibility for engineering wafer fab processes including plasma etch, thin film deposition, lithography, and wet cleans for next generation infrared detector designs. Candidate will design and implement new processes and automate or improve existing ones to support aggressive technology development goals. They will also own different tools and associated modules in the area. Candidate will characterize wafers and devices using SEM and or FIB/SEM. As part of process development, hands-on wafer fabrication and characterization of pilot lots is required. This is the right place for a self-directed, goal-oriented, collaborative engineer. The work is varied and challenging where creative problem-solving opportunities are many. Our culture is collaborative, supportive, and fun. The work environment is mixed general office and clean room/lab.

  • Innovate new processes to enable the technology roadmap
  • Design and execute experiments, analyze data, draw conclusions, document, and communicate results
  • Own tools and process modules in the area
  • Establish feasibility of new processes with hands-on processing of pilot lots on production equipment
  • Characterize results using quantitative metrology tools
  • Automate or improve established processes
  • Document methods and workflows in MES-ready format
  • Plan for statistical process control (SPC) practices as appropriate
  • Evaluate production yield challenges and recommend improvements
  • Collaborate with device physicists, research technicians, and test engineers to participate in overall product R&D cycle
  • Bachelor's degree or equivalent experience in related technical discipline required
  • 0-5 years of related experience desired
  • Proficient computer skills – Word, Excel & Outlook
  • Ability to communicate clearly in written and spoken English
  • Strong data analysis skills (fluency in Excel, MatLAB JMP, Python, SQL, or equivalent is helpful)
  • Ability to use inspection equipment (microscopes, FIB/SEM, interferometers), semiconductor fabrication equipment, and wet bench chemistry
  • Direct experience with one or more key wafer fabrication processes
  • Familiarity and/or strong desire to learn microelectronic/semiconductor and MEMS fabrication techniques
  • Applicants must be either a U.S. citizen or Perm Resident
  • Wafer processing tools for semiconductor or MEMS fabrication
  • Infrared detector technology
  • Statistical Process Control and Design of Experiments familiarity desired
  • Lean Six Sigma or other problem solving/decision making methods (8D, Kepner-Tregoe, or equivalent)
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