Wafer Assembly TD Strategic Program Manager

Intel•Hillsboro, OR

5d•Onsite

About The Position

As a Strategic Program Leader in Wafer Level Assembly TD, you will play a pivotal role in driving Intel's technology development and enablement efforts, transforming innovative concepts into scalable solutions. Your expertise will directly influence Intel's manufacturing excellence and future technology roadmaps. By owning the development of sophisticated manufacturing processes and collaborating with cross-functional teams, you will contribute to the production of groundbreaking devices that push the boundaries of technological innovation. This is your opportunity to shape the future of Intel's process technologies, delivering impactful solutions that resonate throughout the industry.

Requirements

Demonstrated expertise in manufacturability, process development, and process improvement within a high-tech environment.
Advanced proficiency in manufacturing process characterization, technical documentation, and problem-solving techniques.
Proven ability to design and optimize processes, including material selection and parameter optimization.
Strong ability to communicate technical concepts and collaborate effectively across multidisciplinary teams.
Bachelor's or BS degree in a specialized field (e.g., Engineering, Materials Science, Physics, Chemistry) or equivalent experience per business needs.
12 years of relevant experience with a Bachelor's degree, 8 years with a Master's degree, or 6 years with a PhD.

Nice To Haves

Experience leading cross-functional projects and influencing supplier partnerships to drive technology development.
Depth of knowledge in emerging industrial trends and their relevance to Intel's process technology needs.
Familiarity with developing cost-sensitive roadmaps and coordinating with vendor ecosystems to achieve strategic goals.

Responsibilities

Lead the design and development of advanced manufacturing processes, build strategies for space, factory positioning, and capacity buildout for future technology nodes at Intel Wafer Assembly
Develop manufacturability and functional requirements for innovative device architectures and process flows
Conduct theoretical simulations and practical engineering feasibility studies to evaluate process capabilities and assess how we would deliver them to market
Partner with equipment and materials suppliers to implement enabling technologies that align with Intel's roadmap.
Identify and implement modifications to operating equipment and factory infrastructure to improve production efficiency, manufacturing techniques, and optimize output.
Monitor and analyze industrial process and material manufacturing trends to develop cost-effective future technology roadmaps.
Create technical documentation and maintain relevant standards to support process characterization, process improvement, and manufacturability.
Perform pathfinding activities to establish technologies that support future innovative device designs.