2027 Undergrad ASIC Package Engineering Co-op/Intern
Advanced Micro Devices, Inc•San Jose, CA
•Hybrid
About The Position
As an AMD intern or co-op, you’ll be placed at the epicenter of the AI ecosystem, working alongside experts and industry pioneers. You’ll do important work, learn new skills, expand your network, and gain real-world experience on projects that impact millions of end-users worldwide. Whether you’re an undergrad or a PhD student, your contributions matter—and your experience here will be a launchpad for what comes next.
Requirements
- Currently enrolled in a US based University in a Bachelors degree program majoring in Electrical engineering, Engineering Science, Computer Engineering, Mechanical Engineering, Material Science Engineering, or a related field
- Knowledge or experience with courses related to transmission lines and electric circuits
- Knowledge or experience with package, silicon or PCB design software
- Knowledge or experience with scripting languages – Perl / Python / SQL
- Knowledge or experience with semiconductor theory and packaging process/technology
- Knowledge or experience with data analytics and data visualization tools like powerBI
Responsibilities
- Supporting Package design and Package Development Engineers in prioritizing and optimizing new projects
- Completing substrate, interposer and bump designs for AMD products, test vehicles and probe card substrates
- Completing projects related to design verification implementation to ensure design performance, quality and efficiency
- Analyzing yield and defect metrics to ensure design performance and help improve the yield
- Evaluating and benchmarking packaging materials and interacting with partners to achieve the most cost-efficient design and materials for the best performance and yield requirements
Benefits
- AMD benefits at a glance
Stand Out From the Crowd
Upload your resume and get instant feedback on how well it matches this job.
Upload and Match Resume
What This Job Offers
Job Type
Full-time
Career Level
Intern
