Thin Films Module Engineering - PhD Intern

Intel•Hillsboro, OR
•Onsite

About The Position

As a Module Engineering PhD Intern, you will help develop and sustain semiconductor manufacturing processes for a specific module. The role includes supporting equipment troubleshooting, performing maintenance and qualification activities, and collaborating with engineering teams to improve process control methodologies. It offers hands-on experience in semiconductor manufacturing and preparation for a future engineering career. The intern will join Intel Foundry’s Manufacturing Development and Customer Engineering (MDCE) team. MDCE improves process capability across multiple technology nodes, from initial product qualification through high-volume manufacturing, with a focus on yield improvement, performance enhancement, variation reduction, and cost reduction. The team works in areas including Diffusion, Dielectrics, Implant, EPI, and FE Metals. This is an on-site role in Hillsboro, Oregon. The ideal candidate is open to a six-month internship schedule beginning in Spring 2027 and continuing through December 2027.

Requirements

  • Currently pursuing a PhD in a relevant STEM discipline, such as Physics, Applied Chemistry, Chemical Engineering, Electronic Engineering, Mechanical Engineering, or Computer Science.
  • Strong analytical and problem-solving skills.
  • Experience writing software code for applications in the relevant major.
  • Excellent written and verbal communication skills.
  • Ability to work independently and as part of a diverse, high-performing team.
  • Willingness to work in a cleanroom environment.
  • Strong attention to detail and a disciplined approach to procedures.
  • Data-analysis skills, including the ability to construct clear data-based problem statements and design experiments.

Nice To Haves

  • Experience with data-analysis tools and software such as JMP, Python, Excel, and AI tools.
  • Ability to summarize data for technical and non-technical audiences.
  • Openness to a six-month internship schedule beginning in Spring 2027 and running through December 2027.

Responsibilities

  • Assist with developing and implementing thin film manufacturing processes for a specific module in semiconductor production.
  • Support troubleshooting and maintenance of manufacturing equipment.
  • Participate in equipment qualification to ensure compliance with quality and functional standards.
  • Collaborate with engineering teams to optimize process control methodologies and achieve production targets.
  • Build working relationships and partner with technology development, high-volume manufacturing, and cross-functional stakeholders.
  • Analyze data trends, identify process-improvement solutions, and drive automation improvements, using AI where applicable.
  • Contribute to sustaining and improving manufacturing tools and processes.

Benefits

  • Competitive pay
  • Stock bonuses
  • Health benefits
  • Retirement benefits
  • Vacation
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