Thin Films Module Development Engineer

Intel•Hillsboro, OR

13d•Onsite

About The Position

Intel Foundry is seeking highly motivated Thin Films Metals Module Development Engineers to join the Technology Development (TD) organization to accelerate development of advanced process development for applications in high-k/metal gate, contact, and interconnect. In this role you will be responsible for delivering metals process definition, development, and optimization in metal deposition modules.

Requirements

PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, or a closely related STEM field
With at least 1+ years of experience in: Working knowledge of one or more thin film deposition technologies such as ALD, CVD, PVD, sputtering, evaporation, electrochemical deposition, or related vacuum process technologies
Demonstrated ability to analyze process data using statistical methods, structured troubleshooting, and robust experimental design

Nice To Haves

Experience in thin film metal deposition process development for high-k/metal gate stack, contact metallization, or Cu interconnect barrier/liner/plating
Experience with materials characterization and metrology methods such as XRF, XPS, XRD, SEM, TEM, ellipsometry, e-test, defect inspection, reliability, and related techniques
Experience with MOSFET / FinFET / GAA / CFET device characteristics, electrical characterization techniques, and semiconductor device fundamentals
Proficient with data analysis software including JMP, Excel, Python, R, SQL
Strong communication and collaboration skills with demonstrated ability to solve challenging and ambiguous technical problems in a fast-moving and dynamic team environment
Experience using AI-assisted engineering tools to improve technical productivity while maintaining critical independent engineering judgement
Strong written and verbal communication skills with ability to document decisions, summarize technical data, and align cross-functional stakeholders
Availability to work on site and support 24/7 manufacturing operations with on-call rotation

Responsibilities

Primary ownership of thin film metal deposition process development across ALD, CVD, PVD, electrochemical deposition, and related process platforms
Design, implement, and optimize processes to meet specifications for materials, device performance, yield, and process control
Design, execute, and analyze experiments to meet integrated device requirements and support rapid yield improvement
Apply expert knowledge of equipment operating principles, materials characterization and metrology, and device characteristics to accelerate technology development learning cycles
Support novel material and process screening and evaluation, equipment selection, on-time install/qualification of first-of-kind equipment, and design for manufacturability
Partner with cross-functional teams including process integration, device engineering, metrology, yield, manufacturing, and equipment suppliers
Contribute to process pathfinding efforts for next-generation semiconductor technologies through evaluation of novel materials, hardware assessment, process screening, integration development, and silicon validation