Thermal/Stress Analyst

Leidos•Huntsville, AL

1d•$57,850 - $104,575•Hybrid

About The Position

Leidos Defense is seeking a Lead Thermal/Stress Analyst to join our team in Huntsville Alabama designing and analyzing the next generation of defense systems to protect America and its allies. You will perform stress and thermal analysis to support the design of cutting edge aerospace and defense programs. You will collaborate with designers and use Star CCM+ and FEMAP daily to ensure your team’s design meets requirements. You might work alongside the production team to install hardware or verify requirements. Then you’ll work with the testing team to put your hardware into action. This is not your average engineering position. You are applying to be part of a team of the most talented engineers in the region who push you to be better every day. This is a fast-paced program with unique technical challenges that will be a rewarding milestone in any engineering career.

Requirements

Bachelor's Degree in Mechanical Engineering, Aerospace Engineering or equivalent degree from an ABET-accredited university and 2 years or less experience.
Direct experience performing stress and thermal analysis in the aerospace or defense industry.
Demonstrated experience with commercial finite element analysis tools such as FEMAP/NX NASTRAN, PATRAN/MSC NASTRAN, ANSYS, Abaqus, or similar software is essential.
Proven working knowledge of commercial thermal analysis and CFD tools like STAR-CCM+, Thermal Desktop/SindaFluint, ANSYS, or SolidWorks FlowSimulation.
Strong technical writing, presentation, and cross-functional collaboration skills.
Proven ability to thrive in a collaborative, multi-disciplinary engineering environment.
Capable of working as part of a larger analysis team or working as the sole analyst on a project.
U.S. Citizenship is required and eligibility to obtain and maintain a Final Secret Clearance.
Residency in the Huntsville, AL area or willingness to relocate to Huntsville, AL is required.

Nice To Haves

Fluid lumped capacitance modeling
Electronics cooling analysis
Thermal analysis of orthotropic materials
FEMAP/Nastran
Coupled thermal-structural analysis
Bolted joint and weld analysis
Dynamics analysis (modal, response spectrum, shock, vibration)
Fatigue analysis
Composite materials

Responsibilities

Perform stress and thermal analysis on structural, electronic, and mechanical systems while supporting critical test activities.
Produce models, perform calculations, reduce data, and correlate test results to ensure accuracy and reliability for stress analysis.
Conduct detailed steady-state and/or transient thermal analyses using industry-standard programs, producing models, performing calculations, reducing data, and correlating test results to thermal and flow models for thermal analysis.
Collaborate closely with design and manufacturing teams to create designs that meet stringent performance, manufacturability, and schedule requirements.