Thermal data Analysis Engineer

Intel Corporation•Chandler, AZ

1d•$164,470 - $232,190•Onsite

About The Position

The Thermal Engineer will drive thermal design and analysis for GPU, AI accelerators, and data center products through both simulation and hands-on experimental work. This role supports the development of high-performance computing solutions by ensuring thermal requirements are met across silicon, package, and platform levels. The engineer will contribute to thermal performance optimization, laboratory testing, and the development of innovative thermal characterization methodologies for next-generation computing products.

Requirements

PhD in Mechanical Engineering, Thermal Sciences, Aerospace Engineering, Chemical Engineering, or a related technical field; OR a Master's degree in one of these disciplines with 2+ years of experience in thermal engineering, thermal sciences, or a related field.
2+ years of experience using thermal simulation tools such as Computational Fluid Dynamics (CFD) and/or Finite Element Analysis (FEA) OR 2+ years of experience performing thermal characterization, validation, and experimental testing in a laboratory environment OR 2+ years of experience applying heat transfer principles to thermal management solutions for electronic, semiconductor, data center, or high-performance computing products.
Strong analytical and problem-solving skills with the ability to evaluate complex technical challenges and develop effective solutions.
Ability to work effectively in cross-functional and multidisciplinary teams.
Strong verbal and written communication skills, with the ability to clearly communicate technical concepts to both technical and non-technical audiences.
Ability to translate simulation results, experimental findings, and technical analyses into actionable design recommendations.
Demonstrated ability to manage multiple priorities and work effectively in a fast-paced environment.
Strong attention to detail and commitment to technical excellence.
Self-motivated with the ability to work independently while contributing to team objectives.
Demonstrated collaboration and stakeholder management skills when working with internal and external partners.

Nice To Haves

2+ years of experience supporting semiconductor, GPU, AI accelerator, server, or high-performance computing products.
Experience with advanced cooling technologies such as immersion cooling, two-phase cooling, microchannel cooling, or liquid cooling solutions.
Experience developing thermal metrology and measurement techniques.
Experience with thermal instrumentation and data acquisition systems, including thermocouples, infrared cameras, flow meters, and related equipment.
Experience correlating simulation results with experimental data.
Experience with prototype development and rapid testing methodologies.
Familiarity with statistical analysis and experimental data processing.
Understanding of power electronics and energy efficiency concepts.
Experience translating experimental results into thermal design recommendations.

Responsibilities

Support the development of packaging thermal solutions for GPU and AI products.
Develop thermal design strategies for advanced packaging technologies, including chiplets and multi-chip modules.
Perform thermal, electrical, and mechanical co-design optimization activities.
Conduct thermal simulations and analyses to support product development and performance objectives.
Design and execute experiments to characterize thermal performance from advanced package to system-level cooling solutions.
Develop innovative thermal metrology techniques for next-generation thermal management solutions, including two-phase cooling systems and microchannel heat spreaders.
Correlate experimental data with simulation results to improve predictive modeling accuracy.
Support the development and validation of thermal characterization methodologies and test plans.
Partner with silicon design, packaging, platform, and system engineering teams to ensure thermal compliance and performance targets are achieved.
Collaborate across engineering disciplines to optimize thermal solutions for advanced computing products.
Engage with external customers and ecosystem partners to align thermal solutions with product requirements and industry needs.
Communicate technical findings and recommendations to stakeholders across multiple organizations.