Thermal Analysis Engineer

Intel Corporation•Chandler, AZ

2d•$164,470 - $232,190•Onsite

About The Position

As a Semiconductor Research Engineer, you will drive scientific innovation and research that shapes the future of semiconductor technologies. This role focuses on designing, simulating, and developing novel devices, packages, and interconnects using device physics, electromagnetics, and advanced materials science. You'll lead hands-on experiments to build prototypes that demonstrate groundbreaking concepts and collaborate across teams to establish methodologies that optimize performance, reliability, and cost. Your contributions will directly impact Intel's advancements in assembly packaging platform technologies, ensuring the company remains at the forefront of the industry. Join Intel Corporation's Thermal Core Comp organization, a team dedicated to enabling next-generation semiconductor technologies. This group leverages cutting-edge research and development efforts to ensure Intel delivers innovative assembly and packaging solutions that advance device miniaturization, high-speed signaling, and thermomechanical capabilities. As part of this team, you'll contribute to Intel's mission of transforming technology landscapes and driving industry progress.

Requirements

Bachelor's or BS degree in Electrical Engineering, Physics, Materials Science, Mechanical Engineering, or a related field.
6+ years of experience with a bachelor's degree, 4+ years with a master's degree, or 2+ years with a PhD.
Advanced experience in semiconductor fabrication processes, such as lithography, etch, diffusion, and packaging design methodologies.
Advanced experience in simulation tools (e.g., Ansys, Abaqus) for finite element analysis and computational fluid dynamics.
Advanced experience in programming skills in Python or MATLAB for engineering applications.
Hands-on experience with experimental setups and data analysis techniques for lab testing.

Nice To Haves

Experience with advanced packaging technologies, including EMIB and Foveros architectures.
Expertise in Design of Experiments (DOE), statistical analysis methods, and model-based problem-solving techniques.
Familiarity with materials characterization techniques and cross-disciplinary collaboration with academia and external partners.
Proven ability to lead and influence technical teams to achieve milestones and drive performance improvements.
Strong analytical and problem-solving abilities to address unique engineering challenges effectively.
Excellent organizational and communication skills, with experience presenting findings and mentoring team members.

Responsibilities

Conduct research leveraging device physics, thermomechanical analysis, materials science, and process innovations to enable novel devices and systems.
Design and fabricate prototypes to demonstrate proof-of-concepts for groundbreaking packaging and interconnect technologies.
Perform electrical testing and establish methodologies for device characterization, including DC, RF signal analysis, pulsing, and stressing.
Develop process solutions across production modules, such as lithography, etch, diffusion, CVD, PVD, and CMP, to address technological challenges.
Plan and execute experiments in collaboration with device, reliability, and fabrication teams to benchmark results against industry standards.
Develop models and measurements to advance the understanding of device physics, packaging, and systems for future technology platforms.
Engage with external vendors and researchers to support collaborations and Intel's research pipeline.