TEM Engineer

MicronBoise, ID
Onsite

About The Position

Micron Technology's Technology and Products Group in Boise, Idaho, is seeking a DRAM TEM Engineer for its advanced TEM lab. This role involves working with research and fab engineers to develop new processes, materials, and expedite product transfers to improve yield. The lab is equipped with state-of-the-art transmission electron microscopes (TEMs) and focused ion beam (FIB) machines, crucial for analyzing memory devices. The successful candidate will be placed at an appropriate Engineer level based on their experience in analytical TEM work, FIB/TEM automation, and education.

Requirements

  • Ph.D. degree in Materials Science & Engineering, Physics, or a semiconductor-related field.
  • Strong analytical TEM expertise, including atomic-resolution STEM, EELS, and 4D-STEM.
  • Hands-on experience in FIB sample preparation.
  • Strong data science skills applied to TEM workflows (e.g., data processing, automation, modeling, or machine-learning-based analysis).
  • Proficient programming skills using GMS scripts and/or Python.
  • A strong teamwork mindset with a collaborative, solution-oriented approach.

Nice To Haves

  • Strong track record demonstrating innovation, ownership, and a hard-working attitude.
  • Ability to work independently or in teams, as needed.
  • Proven ability to simplify complex technical problems and provide clear, actionable direction.
  • Strong communication skills and the ability to build effective peer and customer relationships.
  • Demonstrated ability to quickly learn new skills and to mentor or coach others effectively.

Responsibilities

  • Perform daily FIB lamella preparation and TEM analysis, including microstructure and chemical analysis using electron diffraction, EDS, and EELS to support Micron TD and manufacturing activities.
  • Provide detailed pass-down information to the next shift for smooth transition.
  • Contribute to the optimization of existing lab procedures.
  • Collaborate closely with process development teams to resolve issues in new part/module development.
  • Develop and adopt advanced FIB/TEM techniques, with an emphasis on AI/automation for semiconductor process utilization.
  • Develop and adopt solutions to enhance the efficiency of data acquisition and data processing in TEM.

Benefits

  • Choice of medical, dental, and vision plans.
  • Benefit programs that help protect your income if you are unable to work due to illness or injury.
  • Paid family leave.
  • Robust paid time-off program.
  • Paid holidays.
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