Technician VI Tier 3

HP EnterpriseSunnyvale, CA
Onsite

About The Position

Supports engineering activities such as test, modification, fabrication, and assembly of prototype electronic boards and systems, electro-mechanical systems, experimental design circuitry, or specialized test equipment. This includes hand assembly and disassembly of SMT & BGA components. Works from schematics, diagrams, written, and verbal descriptions, layouts, or defined plans to perform detailed rework functions. Determines methods or actions to rework boards and/or systems. Assists in the design, construction, test, and check-out of test equipment. Uses test, development, or diagnostic equipment including, but not limited to, oscilloscopes, DMMs, and specialized test apparatus.

Requirements

  • Excellent skills in rework of SMT & BGA or small footprint components.
  • 5-10 years experience.

Nice To Haves

  • Excellent verbal and written communication skills
  • Ability to work under high-stress situations.

Responsibilities

  • Perform high-level quality rework requiring inspection utilizing microscopes and soldering hand tools.
  • Balance and prioritize individual work to best support engineering’s needs and minimize testing downtime.
  • Build new test stations and troubleshoot failed test stations.
  • Repair boards with failed, wrong or mis-inserted components, solder shorts, open traces, and other problems.
  • Provide failed components and boards to engineering for evaluation when appropriate.
  • Perform ECO & repair rework as required on PCBs.
  • Rework performed includes wiring, component removal & reinstallation, etch and pad restoration, for both surface mount and thru-hole technology.
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