The Broadband Plasma (BBP) division is the market-leading optical inspection system used by logic, foundry, and memory customers to detect critical defects at advanced nodes. These tools combine broadband plasma technology with unmatched sensitivity and speed to support high-volume manufacturing. In this role, you will be a key member of our highly integrated multi-disciplinary team of software, systems, applications and algorithm engineers, playing a key part in advancing business priorities by delivering high-impact work across your area of expertise. The BBP division provides market-leading patterned wafer optical inspection systems for innovative IC manufacturing. Logic, foundry, and memory customers depend on BBP products to detect yield-critical defects for process debug and excursion monitoring at advanced process nodes. BBP flagship products include the 29xx and 39xx series which leverage Broadband Plasma technology to capture a wide range of defects with ultimate sensitivity at the optical inspection speeds needed for inline defect monitoring.
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Job Type
Full-time
Career Level
Senior
Education Level
Ph.D. or professional degree