Technical Program Manager, RFIC and mmWave Development - TeraWave

Blue Origin • San Diego, CA

1d • Onsite

About The Position

At Blue Origin, we envision millions of people living and working in space for the benefit of Earth. We’re working to develop reusable, safe, and low-cost space vehicles and systems within a culture of safety, collaboration, and inclusion. Join our team of problem solvers as we add new chapters to the history of spaceflight! Blue Origin is pioneering the future of space-based communications with TeraWave, a revolutionary satellite communications network designed to deliver symmetrical data speeds of up to 6 Tbps anywhere on Earth. This multi-orbit constellation will consist of optically interconnected satellites in low Earth orbit (LEO) and medium Earth orbit (MEO), providing enterprise-grade connectivity for critical operations worldwide. Blue Origin is seeking a Principal Technical Program Manager to lead development and execution of advanced RF /mmWave front-end integrated circuit FEIC programs for TeraWave. This role will own program execution from early requirements definition through architecture, IC development, tapeout, silicon bring-up, characterization, qualification, OSAT engagement, and production transition. The TPM will collaborate with foundry, product, test and packaging engineers to monitor third-party IP providers, foundry and EDA partners, OSATs, packaging suppliers, test partners, and system stakeholders to ensure FEIC deliverables align with TeraWave product and mission objectives. The ideal candidate combines formal technical program management discipline with sufficient technical knowledge of RFIC development, semiconductor execution, phased-array systems, and/or satellite communications to credibly lead cross-functional teams, manage complex dependencies, and drive programs from concept to qualified production hardware.

Requirements

• Bachelor’s degree in electrical engineering, or related technical discipline.
• 10+ years of formal experience in technical program management, engineering program management, or equivalent technical leadership roles.
• Experience managing RF IC programs across multiple lifecycle phases, from requirements and architecture through development, validation, qualification, and production.
• Experience creating and maintaining integrated schedules, risk registers, dependency maps, milestone plans, and executive-level program reporting.
• Ability to work effectively with highly technical RF, IC, systems, packaging, test, and manufacturing teams.
• Experience coordinating external partners, vendors, suppliers, foundries, IP providers, OSATs, test houses, or labs.
• Strong communication, decision-making, stakeholder management, and cross-functional leadership skills.
• Ability to manage ambiguity, establish structure, and drive closure across complex technical programs.
• Must be a U.S. citizen or national, U.S. permanent resident (current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.

Nice To Haves

• Master’s degree or higher in electrical engineering, or related technical discipline.
• Experience with Q/V-band, Ka-band, Ku-band, or other microwave/mmWave RF front-end ICs.
• Experience with FEICs or RFICs used in phased-array antennas, SATCOM user terminals, payloads, radar, or high-frequency communications systems.
• Experience coordinating third-party IP integration.
• Experience with RF production test strategy, wafer probe, final test, socketing, load boards, calibration, test correlation, yield ramp, and test time reduction.
• Knowledge of qualification and reliability standards relevant to aerospace, defense, space, automotive, or high-reliability semiconductor products.
• PMP, PgMP, Agile, Lean, Six Sigma, or equivalent formal program management training/certification.

Responsibilities

• Lead end-to-end technical program execution for TeraWave Q/V-band FEIC developments supporting phased-array antenna and digital beamforming systems.
• Coordinate internal engineering teams in the execution of various development lifecycle phases from market and mission requirements through tape out, silicon qualification and reliability testing.
• Build and maintain integrated schedules, milestone plans, deliverables, dependency maps, risk registers, and executive-level program dashboards.
• Drive alignment between FEIC deliverables and system-level PAA/DBF requirements and production cost.
• Manage third-party IP deliverables, including technical specifications, licensing, delivery schedules, documentation, integration collateral, verification expectations, support models, and risk mitigation.
• Drive cross-functional risk management for schedule, resources, technical maturity, supplier performance, foundry readiness, IP availability, test coverage, package performance, qualification, and production ramp.
• Foster a culture of ownership, accountability, collaboration, technical excellence, and disciplined execution.

Benefits

• Medical, dental, vision, basic and supplemental life insurance, paid parental leave, short and long-term disability, 401(k) with a company match of up to 5%, and an Education Support Program.
• Stock Options for all regular employees (working at least 20 hours/week)
• Paid Time Off: Up to four (4) weeks per year based on weekly scheduled hours, and up to 14 company-paid holidays.

What This Job Offers

• Job Type: Full-time
• Career Level: Principal