Technical Lead, Hardware Engineering, Google Cloud

Google•Sunnyvale, CA
•$188,000 - $274,000

About The Position

Be part of a team developing custom silicon solutions that power Google products. As the Technical Engineering Lead in Hardware Engineering, you will pioneer high-impact engineering solutions and mentor and develop a team to improve efficiencies for the next generation of Google’s data center infrastructure. You will provide cross-functional leadership in partnership with electrical, mechanical, firmware, software, and thermal engineers. You will drive end-to-end technical strategy, identify high-value opportunities, guide executive decision-making, and deliver programs from concept through global deployment. The role involves navigating ambiguity, fostering technical excellence, and making data-motivated decisions that shape foundational infrastructure. The Platforms Infrastructure Engineering team designs and builds the hardware and software technologies that power Google services. The team develops custom hardware in-house to address complex computational challenges. Hardware engineers design and build systems for Google’s computing infrastructure and work on those systems from concept through high-volume manufacturing, contributing to the machinery used in Google data centers.

Requirements

  • Bachelor’s degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or equivalent practical experience.
  • 6 years of experience working in a hardware systems development environment.
  • Experience across the full product life cycle, from design through deployment.
  • Experience leading JDM/CM partnerships and design reviews.
  • Experience driving system-level architecture.

Nice To Haves

  • Master’s degree in Business Administration, Electrical Engineering, Mechanical Engineering, Physics, or a related field.
  • 10 years of engineering experience, with an understanding of data center technical environments.
  • Experience with data center equipment development.
  • Experience managing eCAD tools and workflow development.
  • Experience managing a technical team.
  • Experience overseeing lab validation strategy, hardware system bring-up, and root-cause analysis for complex debugging.

Responsibilities

  • Drive end-to-end system architecture, technology roadmap, and board-level design for next-generation platforms, establishing technical direction and design standards.
  • Lead multidisciplinary trade-off analyses across system, mechanical, thermal, and PCB layout teams to define high-density interconnect strategy, stackup architecture, and routing guidelines.
  • Architect Power Delivery Networks (PDN) and high-speed signal pathways with signal-integrity and power-integrity experts, establishing guidelines for robust hyperscale performance.
  • Lead execution and technical design reviews with JDM/CM partners, implementing engineering changes to accelerate project delivery.
  • Lead cross-functional engineering initiatives with Silicon, Firmware, Software, Thermal, Mechanical, and Operations teams to deliver cohesive, scalable infrastructure solutions.
  • Influence manufacturing and vendor roadmaps to optimize design for manufacturing and design for test for high-volume, enterprise-grade deployments.
  • Mentor and develop a team.
  • Drive technical strategy, identify high-value opportunities, and guide executive decision-making.

Benefits

  • 20% bonus target
  • Equity
  • Benefits
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