Tech Proj/Prog Manager IV

Applied Materials•Santa Clara, CA

9d•$133,500 - $183,500•Onsite

About The Position

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world. You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.

Requirements

Demonstrates depth and/or breadth of expertise in own specialized discipline or field
Interprets internal/external business challenges and recommends best practices to improve products, processes or services
May lead functional teams or projects with moderate resource requirements, risk, and/or complexity
Leads others to solve complex problems; uses sophisticated analytical thought to exercise judgment and identify innovative solutions
Impacts the achievement of customer, operational, project or service objectives; work is guided by functional policies
Communicates difficult concepts and negotiates with others to adopt a different point of view
Possess deep semiconductor equipment, automation, robotics, substrate handling, or system integration experience.
Demonstrate the ability to operate simultaneously as a Product Manager, Systems Architect, and Program Manager.
Have strong technical credibility with engineering teams while effectively influencing senior business leaders and customers.
Understand advanced packaging technologies, AI/HPC market trends, and the manufacturing challenges associated with non-standard substrates.
Excel at driving alignment across diverse organizations without direct authority.
Be comfortable engaging directly with leading-edge customers and ecosystem partners to define future technology requirements.
Demonstrate strong strategic thinking, business acumen, and execution discipline.
Thrive in highly ambiguous environments where cross-functional leadership and systems thinking are critical for success.
10+ years in semiconductor equipment, advanced packaging, automation, systems engineering, product management, or platform development, with a proven track record leading complex cross-BU initiatives from concept through customer adoption.

Responsibilities

Prepares project plans and drives the project from conception and planning to implementation. Will participate in the development of strategies, processes and resources.
Manages project schedule and task details by utilizing project management tools such as reports, tracking charts, checklist and project scheduling software.
Coordinates allocated resources from within the Division to achieve on-time and within budget performance objectives for the project. Initiates and manages purchase requisitions, and purchase orders.
Drives cost schedule performance of equipment for internal and external customers and vendors worldwide.
Participates on multifunctional design teams comprised of internal, external and/or matrixed headcount to complete projects. Provides technical input to team members to achieve project goals.
Interfaces and coordinates within the division to define project objectives, provide status updates and prepare for release and deployment.
Provides engineering and business process expertise to team and other members on various standard programs / issues.
Identifies and resolves potential complications within the project and develops solutions for resolution.
Own the SSH product vision, strategy, roadmap, and business case across all BUs.
Drive alignment of system-level requirements between Platform COE, CSS, BU’s (incl. HI), customers, and engineering teams.
Translate customer challenges and advanced packaging technology trends into prioritized product and platform requirements.
Lead cross-functional roadmap planning and execution, ensuring alignment across hardware, software, automation, robotics, metrology, and subsystem teams.
Partner with PDC, Metrology organizations, external vendors, and leading-edge customers to identify future substrate handling requirements and technology gaps.
Act as the system integration leader for SSH capabilities across multiple product platforms.
Establish governance, prioritization, and program management processes to drive execution across a broad stakeholder network.
Develop business growth strategies, market assessments, and value propositions that expand Applied's position in advanced packaging and AI-driven manufacturing.