Tech Integration Engineer

Absolics Inc•Covington, GA

3d•$100,000 - $160,000•Onsite

About The Position

The Tech Integration Engineer leads advanced packaging substrate integration from customer requirements through qualification and mass production. The role serves as the primary customer technical interface and owns cross-process gray-zone issues by aligning internal teams, identifying root causes, and driving timely resolution. Strong knowledge of advanced packaging and end-to-end substrate manufacturing is required.

Requirements

Strong understanding of advanced packaging technologies and end-to-end glass or organic substrate manufacturing.
Ability to translate customer requirements into technical specifications, process flows, and qualification plans.
Proven ability to diagnose cross-process issues, clarify ownership, and lead root-cause resolution.
Experience leading customer-facing and cross-functional technical programs in a semiconductor manufacturing environment.
Strong communication, data analysis, and structured problem-solving skills.
Must be at least 18 years old and authorized to work in the United States.

Nice To Haves

Demonstrated technical ownership, sound judgment, and ability to manage multiple priorities.
Effective cross-functional leadership, stakeholder alignment, mentoring, and executive communication skills.

Responsibilities

Lead advanced packaging substrate integration from customer requirements and design review through qualification, ramp, and mass production.
Serve as the primary customer technical interface and translate performance, quality, reliability, schedule, and cost requirements into internal specifications and action plans.
Maintain end-to-end understanding of substrate processes, including material preparation, via formation, lamination, lithography, etching, plating, inspection, electrical test, and final quality assurance.
Identify and resolve technical gray zones between process modules where ownership, specifications, or root causes are unclear.
Lead cross-process troubleshooting for yield, defect, reliability, dimensional, warpage, adhesion, alignment, contamination, and electrical issues.
Coordinate Process, Equipment, Manufacturing, Quality, Reliability, Product, and Design teams to define ownership, containment, root cause, corrective actions, and closure timing.
Establish process-interface criteria, monitor technical risks and key performance indicators, and communicate status to customers and management.
Apply SPC, DOE, FMEA, and structured problem-solving methods to improve capability, yield, and reliability.