Tapeout & Mask Operations Engineer (2027 New College Graduate)

GlobalFoundries•Essex Junction, VT

1d•$58,400 - $100,800

About The Position

As a Tapeout and Mask Operations Engineer, you will work with a global team of engineers, product owners, and business partners on initiatives that drive process optimization and product modernization across semiconductor tapeout and mask operations. This role provides hands-on experience supporting cloud-based technology transformations, advanced analytics, and automation solutions that improve operational efficiency and customer experience. This position offers the opportunity to: Work with cutting-edge cloud technologies while partnering closely with Product Lines, Manufacturing Fabs, Customer Sales, EDA vendors, cloud providers, and IT teams to modernize tapeout workflows. Drive measurable business impact through the development of innovative tools, dashboards, and analytics solutions that improve quality, efficiency, and visibility across tapeout operations. Build expertise in semiconductor manufacturing processes while gaining end-to-end exposure to the customer tapeout lifecycle through cross-functional collaboration and agile project execution. Explore emerging technologies, including AI/ML applications and cloud-native services, to enhance operational performance and decision-making.

Requirements

Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, Data Analytics, or a related technical discipline from an accredited institution, graduating in 2027.
Minimum cumulative GPA of 3.5 with demonstrated academic achievement.
Experience developing automation, analytics, or process improvement solutions using technologies such as Python, Angular, Amazon QuickSight, and Microsoft Power Platform.
Knowledge of relational and non-relational database technologies and data processing concepts.
Understanding of cloud-based application development and the use of platform services to build scalable business solutions.
Familiarity with software development lifecycle methodologies and project management tools such as Azure DevOps (ADO), Jira, Git, Jenkins, and Bamboo.
Strong written and verbal communication skills in English.

Nice To Haves

Previous internship, co-op, research, or relevant industry experience.
Demonstrated leadership experience through academic projects, student organizations, competitions, volunteer activities, or workplace initiatives.
Strong analytical, problem-solving, and project management skills with the ability to navigate ambiguity and drive results.
Excellent organizational, communication, and collaboration skills.
Self-motivated with a continuous improvement mindset focused on enhancing systems, processes, and documentation.
Exposure to semiconductor manufacturing, foundry operations, EDA workflows, or related technologies is a plus.

Responsibilities

Enable and support scalable Electronic Design Automation (EDA) functions within cloud-based environments.
Develop and enhance applications and automation solutions that improve tapeout workflow efficiency and user experience.
Create dashboards, visualizations, and reporting tools that transform EDA tool outputs into actionable business insights.
Analyze Tapeout Operations key performance indicators (KPIs) to identify optimization opportunities and improve overall performance.
Support customer tapeouts, mask manufacturing operations, and wafer start enablement activities.
Collaborate with cross-functional teams to drive continuous improvement initiatives, process standardization, and operational excellence.
Research and evaluate new technologies, including AI/ML and AWS services, to support future business transformation efforts.
Perform all activities in a safe and responsible manner while supporting Environmental, Health, Safety, and Security (EHS&S) requirements and programs.