Systems IC Architect
About The Position
We are seeking a visionary System IC Architect with deep expertise in system-level architecture, high-performance power conversion, and semiconductor packaging technologies. This role is pivotal in defining next-generation Point of Load (PoL) solutions for APS, driving innovation in advanced power management with System-in-Package (SiP) integration. We’re looking for a candidate to define products, shape architecture strategy, and support the launch of Point-of-Load (PoL) power solutions that meet latest system-level requirements. Key focus areas include high-performance core power for automotive applications and AI compute platforms. The role centers on Advanced Power Management for PoL solutions. Expertise in AI compute power is essential, and experience in automotive power management is a strong plus.
Requirements
- Expertise in AI compute power is essential.
- Expertise in System-in-Package (SiP) integration is essential.
- Knowledge of AI Compute Power Solutions is critical.
- Proficiency in circuit simulation tools (e.g., Cadence Spectre, PSPICE, HSPICE, Saber, Simetrix/Simplis, Verilog-AMS) and knowledge of PCB materials and stack-up.
- Demonstrated ability to lead cross-functional, global teams and manage complex projects.
- Excellent communication and interpersonal skills; ability to collaborate across diverse teams.
- Creative mindset with strong problem-solving capabilities.
Nice To Haves
- Experience in automotive power management is a strong plus.
- Automotive Power Management experience is a plus, highly valued.
- Master’s degree in Power Electronics, Electrical Engineering, or related field (Ph.D. preferred).
- 15+ years of experience in power semiconductors, packaging, and system-level integration.
- Proven track record in product definition through revenue realization.
- Strong expertise in thermal management, electrical performance, and advanced reliability.
- Experience in Powering high performance compute SoC platforms, with automotive-grade standards highly valued.
- Experience in systems developed according to Functional Safety standard is a plus (ISO26262 and/or IEC61508).
- Willingness to travel globally.
Responsibilities
- Own System IC Architecture, to define product concepts and specifications for power semiconductor modules and System-in-Package (SiP) solutions.
- Develop and maintain long-term product and technology roadmaps in collaboration with product line leaders and R&D teams.
- Translate customer requirements into innovative packaging and power management solutions.
- Support development through thermal optimization and electrical analysis.
- Partner with system solution architects and IC product architects to ensure solutions meet stringent performance, efficiency, space, and cost targets.
- Lead integration of ICs and power semiconductors into advanced packages and systems.
- Drive early-phase engineering and architecture for AI compute, automotive 48V systems, and electrification platforms.
- Provide strategic insights on state-of-the-art power management technologies and benchmark readiness.
- Analyze customer-specific needs to deliver optimized power efficiency and thermal management strategies for enhanced reliability.
- Report KPIs and project status to executive stakeholders.
Benefits
- online and offline learning opportunities to help you develop some of your core and professional skills.
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What This Job Offers
Job Type
Full-time
Career Level
Senior
