System Thermal Engineer - AI and Compute Server Development

Hyve SolutionsFremont, CA
$181,000 - $240,000

About The Position

As a Staff-level System Thermal Engineer at HYVE Solutions, you will be responsible for the hands-on thermal design and validation of Hyve's next-generation AI and compute servers. You will collaborate with the Principal thermal lead and cross-functional hardware teams to design and test both air-cooled and liquid-cooled solutions. Your role will involve performing thermal and CFD analysis, supporting system bring-up, and ensuring platforms meet performance, reliability, and manufacturability targets throughout the production ramp.

Requirements

  • Bachelor's or Master's in Mechanical Engineering, Thermal Engineering, or a related discipline.
  • 8+ years of hands-on thermal design experience for servers, GPU platforms, or high-power electronics, including system bring-up and validation.
  • Solid working knowledge of airflow and thermal design, heatsinks and cold plates, CFD/thermal modeling tools, and lab instrumentation and measurement techniques.
  • Hands-on problem solver comfortable in lab environments, with the ability to turn thermal data into practical design changes and communicate clearly across teams.

Nice To Haves

  • Exposure to liquid cooling and hyperscale deployments preferred.

Responsibilities

  • System thermal design: Develop and optimize airflow paths, heatsinks, cold plates, and fan/ducting solutions for high-power GPU, CPU, VR, and memory components across air-cooled and liquid-cooled platforms.
  • Thermal modeling and analysis: Perform CFD and thermal simulations to guide component placement, system layout, and cooling margin evaluation under worst-case workloads and environmental conditions.
  • Lab validation: Instrument systems with temperature, flow, and pressure sensors; execute thermal characterization, stress testing, and margin validation, and correlate results with simulation.
  • Bring-up and debug: Support thermal bring-up during EVT/DVT/PVT, debug hotspots and airflow/flow inefficiencies, and help drive corrective actions through factory ramp.
  • Cross-functional execution: Collaborate with mechanical, hardware, power, and manufacturing teams to embed thermal requirements into board layouts, mechanical stackups, and rack packaging, and participate in design reviews with data-driven recommendations.
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