System Signal/Power Integrity Engineer

Broadcom•Fort Collins, CO

About The Position

This role involves supporting high data rate SerDes applications up to 400G systems, focusing on system-level Signal and Power Integrity design trade-offs and debug. The engineer will collaborate with package, PCB, and silicon designers on measurement-simulation correlation projects, develop models using electromagnetic field solvers (primarily Ansys HFSS and electronic suite), and evaluate material and connector solutions. The position requires simulating schematic models in Keysight ADS, understanding model accuracy trade-offs, and performing VNA/TDR measurements (50GHz+) for correlation with models and simulations. Feedback from these correlation investigations will be used to improve best practices. The role also involves capturing high-fidelity lab measurements, using oscilloscopes, spectrum analyzers, and optical oscilloscopes, and applying knowledge of high-speed data communications, transmission-line theory, electromagnetic-field theory, numerical analysis, VNA/TDR measurements, statistical simulators, and various signal integrity metrics. Project management, documentation, and effective communication of complex concepts are also key aspects of this role. The engineer will determine and document requirements for ASIC package and PCB designs, collaborate with Package and PCB Engineers to fulfill System SI requirements while balancing objectives, and perform pre-layout and post-layout modeling and simulation. The role includes documenting and delivering SI models, supporting customer analysis and debug efforts, and understanding optical/electrical engine concepts, CWDM, OMA, and optical channel impairments. Power Integrity concepts include PDN impedance analysis and design, ultra-low impedance measurements, SMT capacitor performance, and PDN simulations using CPA and/or SI-Wave.

Requirements

BS +12yrs, MS +10 yrs or PhD +7yrs Electrical Engineering or Physics and years experience in one or more of: Signal integrity for high-speed digital applications, Electromagnetic transmission line theory, Microwave theory, Numerical Field solver theory, Power integrity, IC package design, Photonics
EM modeling (Ansys HFSS/SIWave/Q3D and Polar)
Circuit simulation tools (Keysight ADS)
Matlab (desired)
Cadence APD/Allegro (desired)
Other layout tools (desired)
Linux (desired)
Keysight AEL (desired)

Responsibilities

Support high data rate SerDes applications - up to 400G systems
System level Signal and Power Integrity design trade-offs and debug
Collaborate with package, PCB, and silicon designers to complete measurement-simulation correlation projects
Develop models with electromagnetic field solvers: primarily with Ansys HFSS and electronic suite.
Ability to understand laminate design and fabrication techniques and limitations for both package and PCB designs.
Evaluate system, PCB and package material and connector solutions for future designs.
Simulate schematic models and environments within Keysight ADS.
Ensure and know trade-offs for the accuracy of models (3D/2.5D/2D) used for design simulations.
Perform and develop VNA/TDR (50GHz+) measurement techniques and correlate with models and simulations.
Provide feedback and learnings from measurement-simulation correlation investigations to improve best practices for modeling and simulations.
Capture high fidelity lab measurements to be used for correlation and debug purposes
Experience with sampling and real-time oscilloscopes, spectrum analyzers, and optical oscilloscopes.
Understand and apply: High speed data communications, Transmission-line and electromagnetic-field theory, Numerical analysis, VNA/TDR measurements, Bit-by-bit and Statistical simulators for serial data (SerDes) links, Insertion loss, return loss, crosstalk, BER, jitter, and statistical eye diagrams, Work in either time domain or frequency domain, Phase noise analysis as it applies to PLL’s, reference clocks, SerDes TX-RX links, Jitter sensitivity measurement and analysis for SerDes IP
Organize and manage multiple projects
Develop, clearly and effectively document, and track project plans
Effectively communicate complex concepts in conversation, presentations and written documents
Determine and document applicable requirements for ASIC package and PCB designs, drawing from industry standards, customer requirements, and/or APD Broadcom’s internal performance goals
Collaborate with Package and PCB Engineers to fulfill System SI requirements, while balancing objectives (reliability, cost, complexity, etc.)
Pre-layout and post-layout modeling and simulation to support package and PCB engineering for signal integrity
Document and deliver SI models with supporting documentation to customer and internal engineers
Support customer analysis and debug efforts related to our deliverables
Understanding of optical/electrical engine concepts and theory of operation, CWDM, OMA, etc..
Familiarity with optical channel impairments such as chromatic dispersion (CD) and four-wave mixing (FWM).
Power Integrity Concepts: PDN impedance analysis and design, ultra-low impedance measurements, understanding of SMT capacitor performance metrics, use of CPA and/or SI-Wave for PDN simulations.