Subject Matter Expert Electronics Design and Analysis Engineer (Electronic Packaging Design)

Boeing•El Segundo, CA

7d•$146,200 - $197,800•Onsite

About The Position

Boeing Space, Intelligence & Weapons Systems is seeking an exceptional Subject Matter Expert Level Space Electronics Packaging and Mechanical Product Design and Analysis Engineer to join their Electronics Packaging and Product Design Team in El Segundo, CA. This role offers an unparalleled opportunity to be part of a team that conducts full in-house cradle-to-grave work, from initial design concepts to prototyping and final production. Responsibilities include mechanical PCB design, Electronics Packaging, and Thermal/Structural/Vibration Analysis. The engineer will work on satellite missions, multichip modules, microelectronics, and electronic systems, collaborating with world-class engineers and mentors. The on-site satellite factory allows for creativity and expertise delivery, with seamless collaboration with satellite engineers for intricate satellite mission complexities. The company supports innovative thinking, hard work, maturity, integrity, and rewards bottom-line achievement, offering significant potential for long-term career growth.

Requirements

Ability to obtain a US Security Clearance for which the US Government requires US Citizenship as a condition of employment. A final U.S. Secret Clearance Post-Start is required.
Bachelor of Science degree from an accredited course of study in engineering, engineering technology (includes manufacturing engineering technology), chemistry, physics, mathematics, data science, or computer science
9+ years experience using Computer-Aided Design (CAD) tools
Either: Experience with thermal, structural, dynamics, and/or vibration analysis and tools -OR- Experience with Printed Circuit Boards (PCB) design or assembly
Level 4: 9 or more years' related work experience or an equivalent combination of technical education and experience

Nice To Haves

An active Secret clearance
Experience within aerospace or related industry or with space electronics
Experience with ANSYS analysis, Creo CAD, SolidWorks, Finite Element Analysis (FEA), Siemens NX Nastran, MSC Patran, COMSOL Multiphysics
Excellent oral and written communication skills and ability to communicate across multiple disciplines with internal and external customers
Skill and ability to collect, organize, synthesize, and analyze data; summarize findings; develop conclusions and recommendations from appropriate data sources
3+ years experience leading teams on complex projects

Responsibilities

Lead coordination of multi-discipline groups to develop and understand requirements and develop high-level and detailed designs consistent with those requirements.
Guide structural design and configuration development by performing trade studies to optimize structure and meet program requirements.
Performs detailed structural and thermal analysis using hand calculations and analysis tools.
Documents structural analyses and data, required to show compliance with Boeing, customer and regulatory requirements, at a module, slice, and unit level.
Collaborate with Electrical Engineering team to perform sizing and placement studies, as well as layout and route printed circuit boards (PCBs).
Validates designs through various methods of review, testing and analysis.
Develops, deploys and supports new processes and process improvement to enable efficient performance of engineering tasks to reduce cycle time and drive product improvements.
Conducts Root Cause and Corrective Action to investigate failures and go-forward plans.
Identifies, tracks and statuses technical performance measures to measure progress and ensure compliance with requirements.
Supports Supplier Management with make/buy recommendations and other technical services of limited scope.
Investigates emerging technologies to develop concepts for future product designs to meet projected requirements.