Staff SoC DFT Engineer, HBM

Micron Technology • Folsom, CA

13d • $146,000 - $247,000

About The Position

Micron Technology is a world leader in memory and storage solutions. The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads the development of High Bandwidth Memory (HBM) solutions for AI and ML applications. These modern designs use Through Silicon Via (TSV) technology, stacking multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one package to improve memory density and bandwidth through parallelization, aiming for the lowest power per bit solutions. The role involves joining an inclusive, forward-thinking team dedicated to building technologies for virtual reality, neural networks, and next-generation computing. The Staff SoC DFT Engineer will own design for test (DFT) solutions for complex high-bandwidth memory (HBM) system-on-chip (SoC) base-die designs, directly enabling manufacturability, quality, and successful silicon bring-up across current and future HBM generations.

Requirements

• Strong hands-on experience with SoC develop for test (DFT) architecture and implementation, including scan insertion, MBIST/LBIST concepts, boundary scan (JTAG), and ATPG.
• Experience working across full RTL-to-GDS SoC flows and collaborating with synthesis, static timing analysis (STA), and physical design teams.
• Proficiency using industry-standard electronic design automation (EDA) tools from Siemens, Synopsys, and/or Cadence for DFT and implementation.
• Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field, or equivalent practical experience.
• Seven or more years of relevant experience in SoC design, DFT, or implementation for complex digital application-specific integrated circuits (ASICs) or SoCs.

Nice To Haves

• Experience with large, complex SoCs that integrate multiple intellectual property (IP) blocks and subsystems.
• Strong RTL debugging, design analysis, and problem-solving skills.
• Experience using scripting languages such as Python, Tcl, or Perl for flow automation.
• Familiarity with memory systems such as dynamic random-access memory (DRAM), high-bandwidth memory (HBM), and related JEDEC specifications.

Responsibilities

• Own SoC-level DFT structures and their implementation, including scan, memory built-in self-test (MBIST), logic built-in self-test (LBIST) where applicable, boundary scan (JTAG), and test access architectures for HBM base-die builds.
• Define and drive DFT architecture early in the design cycle, ensuring alignment with SoC integration, floorplanning, timing, power, and physical design requirements.
• Implement and integrate DFT logic at block, subsystem, and full-chip levels while partnering closely with register-transfer level (RTL) design and SoC integration teams.
• Complete and sign off DFT flows, including linting, clock-domain crossing (CDC) checks, DFT rule checks, automatic test pattern generation (ATPG) readiness, and coverage closure.
• Collaborate with physical design teams to optimize DFT solutions for placement, routing, timing closure, and design rule check/layout versus schematic (DRC/LVS) signoff.
• Work with verification, product engineering, test, probe, and manufacturing teams to ensure testability, diagnosability, smooth pre-silicon debug, and post-silicon bring-up.
• Partner with computer-aided design (CAD) and methodology teams to standardize and improve DFT flows, contribute to cross-group technical reviews, mentor engineers as appropriate, and drive innovation for future HBM generations.

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Senior