Staff Semiconductor Process Engineer

Lockheed Martin•Goleta, CA

1d•Onsite

About The Position

Lockheed Martin's Santa Barbara Focalplane Infrared Sensors Business is seeking an experienced semiconductor process engineer to join our team on-site in Goleta, CA. As a Staff Semiconductor Process Engineer, you will be responsible for sustaining/supporting III-V and Si semiconductor wafer process areas, which may include photolithography, in-line metrology, wet/dry etching, thin film deposition, and substrate thinning. Assignments include the definition of processing and handling equipment requirements and specifications, review of processing techniques and methods applied in the manufacture, fabrication, and evaluation of semiconductor devices. You will work with development and process integration engineers to adapt new processes and techniques into the manufacturing line as required. This may include defining requirements for new capabilities and organizing, leading, and executing semiconductor processing equipment capital procurement projects. You will also be responsible for projects related to process definition, fabrication, modification and evaluation of semiconductor devices and components. Data-driven analysis will be required to assess the efficacy of continuous improvement activities.

Requirements

Bachelors degree from an accredited college in Engineering, Physics, or related discipline.
Experience with semiconductor processing areas such as photolithography, metrology, thin film deposition, wet/dry etching and substrate thinning.
Must be a US Citizen, as this position is located at a facility that requires special access.

Nice To Haves

9+ years of industry experience OR advanced degree in Materials Engineering, Chemical Engineering, Mechanical Engineering, or Physics with 7+ years of industry experience.
Experience with automated semiconductor processing equipment for processes such as: automated optical inspection and metrology, photolithography, wet etching, dry etching, lift-off, and thin film deposition.
Proficiency in MS Office (Word, PowerPoint, Excel).
Excellent engineering documentation skills and communication skills.
Ability to interface effectively from the technician level to senior management.
Experience leading multifunctional teams.
Ability to multi-task, organize and prioritize assignments independently.
Experience with Lean/Six Sigma methodologies and data analysis software such as MATLAB or JMP.

Responsibilities

Sustaining/supporting III-V and Si semiconductor wafer process areas, which may include photolithography, in-line metrology, wet/dry etching, thin film deposition, and substrate thinning.
Defining processing and handling equipment requirements and specifications.
Reviewing processing techniques and methods applied in the manufacture, fabrication, and evaluation of semiconductor devices.
Working with development and process integration engineers to adapt new processes and techniques into the manufacturing line.
Defining requirements for new capabilities and organizing, leading, and executing semiconductor processing equipment capital procurement projects.
Managing projects related to process definition, fabrication, modification and evaluation of semiconductor devices and components.
Performing data-driven analysis to assess the efficacy of continuous improvement activities.