Staff Product Engineer (Adv Pkg Pathfinding), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM)

Micron Technology • Boise, ID

1d • Onsite

About The Position

Micron Technology is a world leader in innovating memory and storage solutions. As a member of the HIG HBM Package Product Engineering team, you will lead and develop a high-performing team to drive Package and HBM Product engineering activities within the HBM Systems and Product Engineering Team. This role is part of a distributed team of professional Product Engineers managing a portfolio of Next Generation HBM products, with a focus on Quality, Cost, Cycle Time, and Scale. You will collaborate across functions within and outside of HBM to achieve strategic and tactical objectives while enhancing the efficiency of the HIG HBM PE organization.

Requirements

• Bachelors/Masters/Ph.D. in Electrical, Mechanical, Computer Engineering, Chemistry, Physics, Materials, or related field.
• At least 10 years' experience in semiconductor industry.
• Deep knowledge of sophisticated package process/integration and DRAM or other memory.
• Excellent data extraction, analysis and reporting skills (JMP or other tools).
• Work on site in US with international travel to Singapore, Taiwan.

Nice To Haves

• Familiar with memory's testing methodology.
• Dedicated and highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment (from leading the team to leading technical programs).
• Strong record of collaborative work within/across teams to address sophisticated business and engineering problems.
• Work on site in US with international travel to Singapore, Taiwan.

Responsibilities

• Collaborate with Advanced Package Technology team to enable sophisticated interconnect technology solutions that include wafer to wafer bonding.
• Work with Test Solutions team to enable test solutions, providing analysis of yield and electrical characteristics data.
• Work with engineering teams on electrical failure analysis and develop DFT and characteristic data for sophisticated packaging solutions.
• Work on EFA of advanced packaging failure, and extract and provide electrical and mechanical characteristics data.
• Actively mentor and develop team members to cultivate growth and development within the team and the organization.
• Work closely with various multi-functional teams, including Advanced Packaging, Design, Test Solution teams, Yield Engineering to ensure the multidisciplinary development and successful enablement.
• Develop project management skills within the team to ensure efficient execution of projects, leading to timely delivery of technological solutions.
• Make final decisions on risk analysis and project prioritization, directly impacting the direction of technological development.

Benefits

• Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.
• We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
• Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
• Additionally, Micron benefits include a robust paid time-off program and paid holidays.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Number of Employees: 5,001-10,000 employees