Staff Process Engineer - Electroplating and CMP

Western DigitalFremont, CA
$115,200 - $153,600Onsite

About The Position

WD is building the infrastructure behind the AI-driven data economy. As AI scales, so does data. Every interaction, every model, every system generates data that must be stored, managed, and made accessible over time. That’s where we come in. We combine deep engineering expertise with global-scale manufacturing to deliver the storage systems that make AI possible, powering hyperscale data centers, cloud platforms, and enterprise infrastructure worldwide. This isn’t theoretical work. It’s real systems, at real scale, people solving some of the hardest challenges in technology today. We’re looking for people who want to build, solve, and operate at that level. Join us and let’s shape the future of data.

Requirements

  • Bachelor’s with 5+ years or Master’s with 3+ years of experience in related field, Ph.D preferred.
  • Minimum 3+ years of direct hands-on experience of the techniques and equipment used in electroplating and CMP processes.
  • Strong working knowledge of operating and maintaining electroplating and CMP tools and related equipment is a must.
  • Proficiency in AI-driven data analytics, smart manufacturing systems, and statistical analysis tools like JMP is required.
  • The ability to manage multiple tasks effectively in a fast-paced environment is crucial.
  • Meticulous attention to detail is important to ensure precise and accurate process execution.
  • Demonstrated ability to work in a cleanroom environment wearing full coverall garments for extended periods.
  • Excellent communication, collaboration, problem-solving, and analytical skills.

Responsibilities

  • Manufacturing engineer owner of wet processes (Electroplating and CMP) in magnetic recording head wafer fabrication.
  • Responsible for statistical process control (SPC) of process, chemistries, and tool parameters (film composition & thickness, deposition / removal rates, pressure, temperature, chemical concentration, pH, etc.).
  • Responsible for optimizing process performance (ensure uniform deposition or removal of metal/dielectric materials), maintain process margin.
  • Conduct failure analysis for process/tool deviations that result in defects and affect wafer quality.
  • Participate in the introduction of new processes/materials into manufacturing and take ownership to maintain these under good control and to achieve maturity.
  • Participate in the introduction and qualification of new Wet process equipment for capacity improvement or technology advancement.

Benefits

  • paid vacation time
  • paid sick leave
  • medical/dental/vision insurance
  • life, accident and disability insurance
  • tax-advantaged flexible spending and health savings accounts
  • employee assistance program
  • other voluntary benefit programs such as supplemental life and AD&D, legal plan, pet insurance, critical illness, accident and hospital indemnity
  • tuition reimbursement
  • transit
  • the Applause Program
  • employee stock purchase plan
  • the WD Savings 401(k) Plan
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