Uniformity Staff/Principal Engineer, Front End, Central Product Integration (FE cPIE)

Micron Technology • Boise, ID

2d

About The Position

Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
What’s Encouraged Daily:
Lead process integration (PI) structural uniformity and cross‑loop integration for critical modules (e.g., capacitance loop), owning end‑to‑end integration strategies to resolve yield, quality, and reliability gaps. Drive physics‑ and process‑based integration solutions through close collaboration with cross‑module process owners, PI subject‑matter experts, and key suppliers to optimize integration structures and achieve BIC yield and quality targets.
Develop and apply model‑based root cause analysis frameworks (transport, reaction kinetics, pattern density, and geometry‑dependent effects) to diagnose structural non‑uniformity. Define, implement, and continuously strengthen critical inline monitoring and defense lines (CD, film loss, mass delta, defectivity, edge/periphery metrics) to ensure robust control of structural uniformity.
Own and advance product integration programs and loop‑level domain expertise, maintaining deep technical knowledge across node transitions. Proactively drive node‑over‑node “shift‑left” integration, including early implementation of uniformity, bevel, and backside best‑known‑methods (BKMs) during development phases to accelerate whole‑wafer (center‑to‑edge) yield and quality ramp.
Drive worldwide technical alignment and execution excellence by leading global projects, standardizing and using network BKMs, and scaling proven solutions across sites. Identify efficiency and performance gaps, and lead business process creation, optimization, and re‑engineering to improve benchmark performance, cycle time, and development productivity.

Requirements

• 5+ years' experience in process related role in semiconductor industry.
• Bachelors/Masters/PhD. in EE, Materials Engineering, Materials Science, Physics and Chemical
• Be able to travel to Micron sites as vital for face-to-face teamwork.
• Good logical thinking and knowledge in Semiconductor Fabrication process flows, interaction of different processes and how changes affect yield, device performance and reliability.
• Understanding of DRAM and NAND operation and structure to decipher parametric, probe and qual data from both front end and backend assembly process.
• Good model-based problem solving together with data driven decision making, and presentation skills.
• Proven track record to troubleshoot and solve structure and device related issues, and address root cause.

Nice To Haves

• Good organizational capabilities and ability to work effectively.
• Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities.
• Strong interpersonal skills and customer/co-worker relationships.
• Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics.
• Good multi-tasking, verbal and written communication skills

Responsibilities

• Lead process integration (PI) structural uniformity and cross‑loop integration for critical modules (e.g., capacitance loop), owning end‑to‑end integration strategies to resolve yield, quality, and reliability gaps.
• Drive physics‑ and process‑based integration solutions through close collaboration with cross‑module process owners, PI subject‑matter experts, and key suppliers to optimize integration structures and achieve BIC yield and quality targets.
• Develop and apply model‑based root cause analysis frameworks (transport, reaction kinetics, pattern density, and geometry‑dependent effects) to diagnose structural non‑uniformity.
• Define, implement, and continuously strengthen critical inline monitoring and defense lines (CD, film loss, mass delta, defectivity, edge/periphery metrics) to ensure robust control of structural uniformity.
• Own and advance product integration programs and loop‑level domain expertise, maintaining deep technical knowledge across node transitions.
• Proactively drive node‑over‑node “shift‑left” integration, including early implementation of uniformity, bevel, and backside best‑known‑methods (BKMs) during development phases to accelerate whole‑wafer (center‑to‑edge) yield and quality ramp.
• Drive worldwide technical alignment and execution excellence by leading global projects, standardizing and using network BKMs, and scaling proven solutions across sites.
• Identify efficiency and performance gaps, and lead business process creation, optimization, and re‑engineering to improve benchmark performance, cycle time, and development productivity.

Benefits

• Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.
• We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
• Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
• Additionally, Micron benefits include a robust paid time-off program and paid holidays.
• For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Education Level: Ph.D. or professional degree