TTM Technologies, Inc. is a leading global manufacturer of technology products, including mission systems, radio frequency (“RF”) components, RF microwave/microelectronic assemblies, and technologically advanced printed circuit boards (“PCB”s). TTM stands for time-to-market, representing how TTM's time-critical, one-stop design, engineering and manufacturing services enable customers to reduce the time required to develop new products and bring them to market. This role will participate as a member of assigned product design teams to perform mechanical engineering functions in the design, development and analysis of both current and next generation products for commercial, defense and space applications. The role will support the technical development of the Mechanical Engineering and Design functions through the evaluation and introduction of new design and analysis capabilities. The ideal candidate will possess advanced skills in electronic packaging (i.e. Thermal Analysis, Structural Analysis, Environmental, etc.) and experience with materials and processes involved in electronic packaging.
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Job Type
Full-time
Career Level
Senior