Staff Mechanical Engineer

QorvoRichardson, TX

About The Position

Qorvo is seeking an experienced Mechanical Design Engineer to join the Defense & Aerospace SSPA product development team. This is a senior-level role within the D&A SSPA product development team. You will apply your extensive mechanical experience of RF/electronics circuits, modules and chassis/LRUs design for aerospace/military customers to derive innovative, cutting-edge solid-state RF power amplifier solutions for defense communications, radar and electronic warfare (EW) applications. You will be assigned goals and allocated technical, program, schedule, and cost requirements at a high level. You will derive and implement plans to ensure those goals are met and produce hardware designs in compliance with requirements. You should be comfortable working closely with a cross functional engineering team.

Requirements

  • Bachelor of Science degree in Mechanical Engineering.
  • Minimum of 8 years’ mechanical design experience of subsystems, chassis/LRUs, circuit card assemblies and interconnects of RF and digital electronics for aerospace and military customers.
  • Must be comfortable working as part of a cross functional engineering team with open interchange of ideas.
  • Proven ability to work with limited supervision and meet commitments for assigned technical, schedule and cost goals.
  • Experience with FEA thermal and structural modeling and analysis.
  • Experience with military and aerospace specifications, including environmental requirements (design for extreme temperatures, altitude, vibration, shock, salt fog, etc.).
  • Applicant must be a US Citizen and have the ability to obtain and maintain a US Government security clearance.

Nice To Haves

  • Working knowledge of Solidworks, Ansys and Flotherm is preferred.

Responsibilities

  • Mechanical development and design support of high-power RF amplifiers, sub-systems and chassis/LRUs from concept through volume production.
  • Implement product development plans to ensure all requirements, schedule and cost goals are met.
  • Develop conceptual and detailed designs; create and maintain bill of materials (BOM).
  • Derive and implement novel convective and conductive thermal control solutions for both forced-air and liquid-cooled electronics.
  • Model and conduct FEA thermal, shock and vibration analysis of circuit board assemblies, LRUs and structures.
  • Create and maintain engineering drawings, documentation and bill of materials; perform tolerance analysis using GD&T.
  • Conduct and participate in peer reviews, internal and customer-facing design reviews.
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