Staff IC Packaging Engineer

Qualcomm•San Diego, CA

About The Position

We are seeking a highly motivated Staff IC Packaging Engineer to lead the development and commercialization of advanced integrated circuit (IC) packaging technologies. This role focuses on driving innovation and enabling new product introductions. The ideal candidate will possess deep expertise in advanced packaging architectures and assembly processes, and will lead technology development from concept through high-volume manufacturing (HVM) in collaboration with Outsourced Semiconductor Assembly and Test (OSAT) partners. This position requires strong technical leadership, cross-functional collaboration, and the ability to solve complex engineering challenges.

Requirements

Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience.
Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience.
PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ year of System/Package Design/Technology Engineering or related work experience.

Nice To Haves

Advanced degree (M.S. or Ph.D.) in a relevant engineering discipline
Strong expertise in: Flip Chip (CSP/FCBGA) and Wire Bond technologies
System in Package (SiP) and module integration
Redistribution Layer (RDL), wafer bonding, and advanced packaging (2.5D/3D)
Experience with high-density interconnect design, substrate technologies, and package architecture
Hands-on knowledge of assembly processes, materials, and equipment
Familiarity with wafer-level processes, wafer-on-wafer bonding, and dicing technologies
Understanding of reliability standards, qualification methods, and failure mechanisms
Experience working with OSATs, foundries, and contract manufacturers
Strong background in statistical data analysis and process optimization
Knowledge of laser groove technology and wire bond process optimization is a plus
Six Sigma Green or Black Belt certification is a plus
Experience in IC packaging development and high-volume manufacturing

Responsibilities

Lead development and deployment of advanced packaging technologies including FCCSP, FCBGA, SiP/Modules, RDL-based packages, and 2.5D/3D integration.
Drive new product introduction (NPI) from concept to successful transfer into high-volume manufacturing.
Define and optimize package architectures, including high-density interconnects, die-to-die (D2D) integration, and performance/reliability trade-offs.
Develop and establish process flows, material sets, Best Known Methods (BKM), and process control plans.
Design and execute Design of Experiments (DOE), test vehicles, and process characterization for technology development and qualification.
Collaborate with OSATs, foundries, substrate vendors, and material suppliers to align technology development with product requirements.
Partner with internal design, modeling, and product teams to implement Design for Manufacturability (DFM) and establish design rules.
Lead cross-functional programs, managing timelines, risks, and deliverables across multiple concurrent projects.
Apply strong knowledge of FMEA, SPC/QC, reliability testing, and failure analysis to ensure robust product development.
Troubleshoot and resolve complex technical and manufacturing issues across development and production stages.