Micron Technology is a world leader in innovating memory and storage solutions. The Heterogeneous Integration Group (HIG) is shaping the future of AI and accelerated computing by developing advanced memory solutions, specifically focusing on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance computing (HPC), and data-centric systems. As an HBM Memory Design Engineer – Sustaining (Staff), you will work closely with cross-functional teams including Design Engineering (DE), Product Engineering (PE), Process Integration, Packaging, and Technology Development (TD) to analyze and resolve silicon issues across HBM products. You will collaborate with architecture to understand new or updated specification requirements and contribute to the implementation, verification, and maintenance of design updates, supporting both silicon release and ongoing product lifecycle needs. This role requires strong technical execution and the ability to independently drive complex issues to closure.
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Job Type
Full-time
Career Level
Senior