Staff Burn-in HW & SW Engineer

Advanced Micro Devices, Inc•Austin, TX

About The Position

ADVANCE YOUR CAREER. ADVANCE THE WORLD. At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future. Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. Join us and, together, we’ll advance your career. THE ROLE: Join a global product reliability team that drives product qualifications for the next generation Datacenters and Servers, leveraging advanced silicon and packaging technologies. This position is a highly visible role within the AMD engineering team and is responsible for developing end-to-end Hardware and Software solutions for High Temperature Operating Life (HTOL) and Burn-in test to characterize silicon reliability behavior for new products to align with AMD product and customer requirements. The position provides influence that mandates strong technical and analytical skills. THE PERSON: This role focuses on end-to-end ownership for designing BIB (Burn-In Board) hardware and developing stress/test programs specifically optimized for the MCC test platform as well as other Burn-in platforms. A self-motivated team player who focuses on collaboration, team building, and expanding team success.

Requirements

BS or MS in Electrical Engineering, Computer Engineering or equivalent.

Nice To Haves

Knowledge of HTOL/BI board schematics, layout and PCB development to define requirements.
Knowledge of HTOL/BI DFT pattern architecture, pattern vector timing.
Hands-on experience of programming such as Python/C++/SQL and scripting language.
Knowledge of test pattern architecture, vector translation, vector timing diagrams and developing programs to enable HTOL/BI stress testing.
Experience in Product Reliability Engineering, with exposure to Product Engineering, Test, HTOL/BI environment and test methodology.
Experience with oscilloscope and logic analyzer equipment to debug Burn-in-Boards.
Knowledge of Computer and processor Architecture concepts, a plus.
Knowledge of modeling techniques to develop DOE experiments for Burn-in optimization, a plus.
Knowledge of device degradation models for production guardbands, a plus.
Strong communication skills including data presentation.

Responsibilities

Starting in early product development cycle, collaborating with cross-functional teams to design custom High-Power Burn-In Boards (BIBs) for CPU and GPUs.
Interface with PCB fabrication and socket manufacturers to guide board development.
Establish HTOL/BI pattern requirements for development of stress programs and work with design validation and product engineering teams to bring-up burn-in DFT patterns.
Integrate patterns into stress programs, debug, and maintain reliability test code, utilizing the native MCC C-Breez environment or associated platform software.
Lead hardware validation of First Article boards for HTOL and Burn-in, debug hardware and PNP software issues.
Communicate with offshore factories and reliability labs during HTOL/BI hardware and test program brin-up.
Conduct test data analysis Pre/Post Burn-in experiments to identify opportunities for test program optimization. Create data-logging scripts to capture parametric drift, test logs, and qualification metrics.
Expanded role to support ESD and Latch-up hardware and stress program development.