Staff Assembly Process Engineer

Nokia•Sunnyvale, CA

18d•$139,284 - $200,001

About The Position

Develop, sustain, and improve process yield for die attach, wirebond, inspection tools, and/or process steps used to assemble monolithically integrated optical circuits in a 24x7 manufacturing and development facility. The role focuses on process and tool ownership, equipment performance—including MTBA and MTBF—and new product introduction (NPI). The engineer owns specific COC assembly processes, primarily wirebond and eutectic die attach; leads process expertise across modules and the manufacturing flow; and works with engineers, technicians, operators, and cross-functional teams. The role includes improving process performance, qualifying tools and technologies, supporting new product requirements, and creating procedures and training operators. The position requires working in a clean room and availability for 24/7 factory on-call coverage.

Requirements

Strong hands-on background in assembly technologies and processes for microelectronics manufacturing.
Hands-on operation and maintenance of assembly process tools and metrology equipment.
Technical expertise and ownership in die attach using solder or epoxy bonding on Micron2/Datacon EVO tool platforms.
Experience with wafer-fab or assembly-shop-floor control systems.
Background in process-engineering statistics, including SPC and DOE.
Experience with failure analysis.
Experience with material and tool selection.
Experience with plasma-cleaning equipment and processes.
Ability to troubleshoot and resolve equipment problems.
Hands-on data analysis experience with JMP, MATLAB, or similar packages.
Experience mentoring and training operators, engineering technicians, and junior engineers.
Ability to work closely and coordinate activities with other functional groups.
Good communication and project-management skills.
Safety- and quality-oriented mindset.
Bachelor’s degree in electrical, mechanical, materials engineering, or a related field, plus 8 years of related experience; or a master’s degree plus 5 years of experience in semiconductor packaging and assembly technology in a manufacturing environment.

Responsibilities

Become a process owner for specific COC assembly processes, primarily wirebond and eutectic die attach.
Peer-lead and develop expertise in specific assembly process modules and across the manufacturing process flow.
Organize, analyze, and improve manufacturing processes to meet performance indicators for efficiency, cycle time, yield, and reliability.
Identify and reduce process variability through controlled experiments, analysis, summaries, and presentations of results.
Work in a team environment with engineers, technicians, and operators.
Create written operational procedures and mentor or train operators.
Select, procure, install, and qualify new tools.
Work with development and other functional teams to define assembly requirements for new product introduction.
Identify, develop, and qualify new assembly processes and technologies to support next-generation product needs.
Represent Assembly Engineering in multifunctional teams.
Work in a clean room and follow strict clean-room requirements.
Be available for 24/7 factory on-call coverage.