Sr. Thermal Solutions Engineering Lead

Chase Corporation•Westwood, MA

About The Position

Founded in 1946, Chase Corporation is a global specialty chemicals company and a leading manufacturer of protective materials for high-reliability applications across diverse market sectors. With nearly 800 employees, the company operates manufacturing facilities in the United States, Europe, and Asia, focusing on a related diversification strategy that combines organic growth with strategic acquisitions. Based in Westwood, Massachusetts, USA, Chase Corporation continually invests in its capabilities to deliver value to its global customer base. The Senior Thermal Solutions Leader (TSL) will spearhead the technology roadmap and execution for polymer-based thermal interface materials (TIMs) and potting compounds. These materials are critical for advanced semiconductor packaging and high-density PCB applications. The role requires a strong foundation in applied materials science and formulation, with an emphasis on translating polymer systems, filler technologies, and processing conditions into superior package- and system-level thermal performance, reliability, and manufacturability. The TSL will be responsible for designing and executing experimental programs, refining formulations based on performance data, and guiding materials from laboratory concepts through qualification and commercialization. This position involves close collaboration with Product Development, Manufacturing, and Marketing teams, and also serves as a key technical liaison with customers. Target applications include high-thermal-load environments such as artificial intelligence infrastructure, data centers, and energy management and storage systems.

Requirements

7+ years of industry experience developing, formulating, or validating polymer-based materials for semiconductor packaging, electronics assembly, thermal interface materials, or other high-reliability applications.
Strong applied understanding of polymer chemistry, composite formulation, and additive systems, with the ability to link formulation design to thermomechanical performance.
Experience applying structure–property relationships to manage performance trade-offs across TIM1, TIM1.5, TIM2, and potting compound applications.
Working knowledge of PCB- and advanced-package-level thermal and mechanical environments, including processor packaging, lids/stiffeners, cold plates, and TIM selection and reliability considerations.

Nice To Haves

Advanced degrees preferred.

Responsibilities

Lead formulation and optimization of polymer-based thermal interface materials (TIM1, TIM1.5, TIM2) and potting compounds for advanced semiconductor packaging.
Apply structure–property relationships to guide formulation strategy, performance trade-offs, and portfolio evolution.
Design and execute hypothesis-driven experimental programs linking polymer chemistry, fillers, and processing to thermal, mechanical, and reliability performance.
Generate high-quality data to support stage-gate decisions, technical risk assessment, and commercialization.
Build and evaluate package-level assemblies to assess material performance under realistic thermal, mechanical, and environmental conditions.
Support reliability testing and qualification for high thermal flux and mechanically constrained packaging environments.
Translate material-level results into package- and system-level performance implications.
Lead customer-facing technical engagement for thermal interface and potting materials in advanced semiconductor packaging.
Translate customer requirements into R&D priorities while maintaining a focus on technology leadership.
Partner with hyper scalers and contract manufacturers to accelerate adoption of next-generation thermal solutions in AI and data center applications.
Partner with Product Development, Manufacturing, and Marketing to ensure formulations are scalable, manufacturable, and aligned with portfolio strategy.
Support portfolio validation by providing data, samples, and technical documentation to enable design-in and qualification.