Sr. Staff / Principal Physical Design Engineer

SK hynix memory solutions America Inc.•San Jose, CA
•$160,000 - $220,000

About The Position

Join our Physical Design(SoC Integration) team responsible for delivering high-performance SoC designs from RTL to GDS. As a Sr. Staff Physical Design Engineer, you will lead physical implementation efforts for advanced-node designs, driving critical blocks through synthesis, placement, CTS, routing, and signoff. You will work closely with front-end, DFT, power, and analog teams to optimize PPA (Power, Performance, Area) while ensuring silicon success. This role requires deep hands-on expertise across the full physical design flow as well as leadership to mentor junior engineers and define methodologies for the team.

Requirements

  • Bachelor's degree in Electrical Engineering, Computer Engineering, or related field (Master's preferred)
  • 8+ years of hands-on experience in ASIC physical design with proven tapeout success
  • Expert-level proficiency in synthesis, placement, CTS, and routing using Synopsys or Cadence P&R tools
  • Deep knowledge of static timing analysis (STA) and PrimeTime signoff, including multi-corner/multi-mode closure
  • Demonstrated experience with physical verification using Calibre (DRC, LVS, ERC) and IR drop/EM analysis using RedHawk

Nice To Haves

  • Experience at 5nm or 3nm process nodes with FinFET and multi-patterning design rules
  • Familiarity with low-power design techniques including UPF, clock gating, multi-Vt, and voltage islands
  • Strong programming skills in Tcl, Perl, and Python for flow automation and data analysis
  • Knowledge of ECO implementation and clock reconstruction (CRPR, useful skew) methodologies
  • Experience leading or mentoring a team of physical design engineers on complex SoC projects
  • Exposure to memory-centric interfaces and systems such as SSD SoC, HBM, or HBF (High Bandwidth Flash) base die designs (a plus, not required)
  • Familiarity with chiplet and die-to-die (D2D) interconnect technologies, including Universal Chiplet Interconnect Express (UCIe) or equivalent D2D PHY protocols (a plus, not required)

Responsibilities

  • Lead physical design implementation from synthesis through GDS for high-performance blocks or full-chip SoC designs in advanced process nodes (7nm, 5nm, 3nm)
  • Execute and optimize synthesis, placement, clock tree synthesis (CTS), and routing using industry-standard P&R tools (Synopsys ICC2/Fusion Compiler or Cadence Innovus)
  • Drive timing closure and signoff using PrimeTime (PT), including advanced analysis such as SI, AOCV/POCV, crosstalk, and ECO implementation
  • Perform RC extraction using StarRC or Quantus and ensure strong correlation between extraction and STA results
  • Own physical verification signoff with Mentor/Siemens Calibre, resolving DRC, LVS, ERC, and antenna violations in complex FinFET layouts
  • Conduct power integrity analysis using Ansys RedHawk(Redhawk-SC), including static/dynamic IR drop and EM analysis; implement power grid and decap optimizations
  • Develop and maintain physical design flows and automation scripts (Tcl, Perl, Python), mentor junior engineers, and collaborate with cross-functional teams to achieve tapeout schedules

Benefits

  • medical
  • dental
  • vision
  • life insurance
  • company 401(k) match
  • cafeteria
  • onsite gym
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