Sr Staff Package Design Engineer

Renesas Electronics•Tempe, AZ

21h•Hybrid

About The Position

We are currently searching for a Sr. Staff Package Design Engineer. This role involves designing and developing hermetic/ceramic/metal and RAD (radiation) tolerant / class P plastic packages and interconnect methods for Renesas’s packaging needs in the areas of Commercial Space/ Aerospace and High Reliability power device packaging. You will work with hermetic package suppliers NTK, Kyocera, and Shinko, and be familiar with Mil Std 883, 38535, 750 specifications. The position requires defining package technologies, tooling, and qualification for these applications. You will benchmark, select, and qualify suitable materials, processes, and assembly subcontractors (OSAT) or in-house assembly sites. Collaboration with Renesas product designers to develop detailed package drawings using AutoCAD, and working with OSAT/Palm Bay to run DOE to optimize processes and establish process specs are key responsibilities. You will also work with Product groups and the Reliability team to qualify new packages and processes within the required schedule. Developing and maintaining technical expertise on advances and innovations in hermetic/ceramic/metal and RAD tolerant / class P plastic packages, and participating in packaging roadmap development with a focus on execution are also part of this role.

Requirements

Doctorate/Masters / Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
5-12 years of relevant experience in package development emphasizing hermetic/ceramic /metal and RAD tolerant / class P plastic package.
Strong interpersonal and communication skills.
Strong analytical and presentation skills.

Nice To Haves

Preferred understanding of semiconductor hermetic\plastic IC assembly processes, materials and technology.
Knowledge of AutoCAD, Excel, PowerPoint, Word.
Knowledge of wire-bonding, flip chip, SPC(Statistical Process Control) and statistical analysis a plus.

Responsibilities

Design and develop hermetic/ceramic/metal and RAD (radiation) tolerant / class P plastic package and interconnect methods for Renesas’s packaging needs in the areas of Commercial Space/ Aerospace, High Reliability power device packaging working with hermetic package suppliers NTK, Kyocera, Shinko.
Familiarity with Mil Std 883, 38535, 750 specifications.
Define package technologies tooling & qualification for Commercial Space/ Aerospace, High Reliability Power Applications.
Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT Outsourced Semiconductor Assembly & Test) or in-house assembly site (Palm Bay).
Work with Renesas product designers to develop detailed package drawings for hermetic and plastic packages using AutoCAD.
Work with OSAT (Outsourced Semiconductor Assembly & Test)/Palm Bay to run DOE to optimize processes and establish process specs.
Work with Product groups and Reliability team, qualify new packages and processes within the required schedule from Product Engineer/Program manager.
Develop and maintain technical expertise on advances and innovations in hermetic/ceramic/ metal and RAD tolerant / class P plastic packages.
Participate in packaging roadmap development & focus on execution.