Sr Staff Package Design Engineer

Renesas Electronics • Tempe, AZ

6h • Hybrid

About The Position

Renesas is an embedded semiconductor solution provider with over 22,000 professionals in more than 30 countries, driven by its Purpose ‘To Make Our Lives Easier.’ The company is a leading expert in embedded processing, providing scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power. Renesas designs and develops sustainable, power-efficient solutions. The company is currently searching for a Sr. Staff Package Design Engineer to contribute to its packaging needs in areas such as Commercial Space/Aerospace and High Reliability power device packaging.

Requirements

• Doctorate/Masters / Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering
• 5-12 years of relevant experience in package development emphasizing hermetic/ceramic /metal and RAD tolerant / class P plastic package
• Knowledge of AutoCAD, Excel, PowerPoint, Word
• Strong interpersonal and communication skills
• Strong analytical and presentation skills
• Familiarity with Mil Std 883, 38535, 750 specifications

Nice To Haves

• Preferred understanding of semiconductor hermetic\plastic IC assembly processes, materials and technology
• Knowledge of wire-bonding, flip chip, SPC(Statistical Process Control) and statistical analysis

Responsibilities

• Design and develop hermetic/ceramic/metal and RAD (radiation) tolerant / class P plastic package and interconnect methods for Renesas’s packaging needs in the areas of Commercial Space/ Aerospace, High Reliability power device packaging working with hermetic package suppliers NTK, Kyocera, Shinko
• Define package technologies tooling & qualification for Commercial Space/ Aerospace, High Reliability Power Applications
• Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT Outsourced Semiconductor Assembly & Test) or in-house assembly site (Palm Bay)
• Work with Renesas product designers to develop detailed package drawings for hermetic and plastic packages using AutoCAD
• Work with OSAT (Outsourced Semiconductor Assembly & Test)/Palm Bay to run DOE to optimize processes and establish process specs
• Work with Product groups and Reliability team, qualify new packages and processes within the required schedule from Product Engineer/Program manager
• Develop and maintain technical expertise on advances and innovations in hermetic/ceramic/ metal and RAD tolerant / class P plastic packages
• Participate in packaging roadmap development & focus on execution

Benefits

• Flexible and inclusive work environment
• Global support system
• Remote work option
• Employee Resource Groups
• Opportunities to explore hardware and software capabilities and try new things
• Opportunities to launch and advance career in technical and business roles across four Product Groups and various corporate functions

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Number of Employees: 5,001-10,000 employees