Sr Staff Integration Engineer

FormFactor Inc.•Farmers Branch, TX

4d•Onsite

About The Position

The Sr. Staff Integration Engineer is responsible for defining, optimizing, and sustaining end-to-end process integration flows for probe card manufacturing in a high-volume semiconductor environment. This role serves as a senior technical authority, integrating complex unit processes across wafer-level fabrication, MEMS, precision assembly, interconnect, and electrical test. The position drives yield performance, manufacturability, and scalability by aligning cross-functional engineering, operations, and product teams. The role operates with significant autonomy, leading cross-module problem solving, technology transfer, and continuous improvement initiatives, while mentoring engineers and influencing integration strategy across sites. This role acts as the primary technical interface between process modules, ensuring integrated process flows meet product, quality, and reliability requirements.

Requirements

Assembly Manufacturing
Assembly Operations
Assembly Testing
Probe Cards
Process Integration
Process Operations
Product Integration
Semiconductor Device Fabrication
Semiconductor Fabrication
Semiconductor Industry
Semiconductor Manufacturing
Minimum of 12 years of related experience with a Bachelor’s degree; or 8 years and a Master’s degree; or a PhD with 5 years experience; or equivalent experience

Responsibilities

Own integration strategy across all Assembly & Test operations including Solder paste printing, Surface mount technology (SMT), Pick-and-place assembly, reflow soldering, PCB assembly, Underfill and adhesive processes, Mechanical assembly, Alignment and calibration, Electrical verification, and Final product test.
Define process windows, acceptance criteria, and control plans for critical assembly operations.
Lead optimization of solder joint reliability, component placement accuracy, reflow profiles, coplanity, and assembly yield.
Drive integration improvements between PCB design, assembly processes, probe structures, and final electrical performance.
Develop assembly flow architectures that support volume scalability, cycle-time reduction, and manufacturability.
Partner with contract manufacturers and internal assembly operations to ensure process consistency and technology transfer success.
Analyze assembly-related yield losses including solder defects, placement errors, opens, shorts, warpage, misalignment, and handling damage.
Establish qualification methodologies for assembly materials, solder alloys, adhesives, PCB technologies, and new assembly equipment.
Define, own, and continuously improve end-to-end process integration flows for probe card manufacturing.
Ensure alignment of unit process performance to product-level electrical, mechanical, and reliability targets.
Identify and manage integration risks, interactions, and trade-offs across modules.
Lead integration-level yield improvement initiatives using data-driven analysis and structured problem solving.
Investigate complex yield excursions, defect mechanisms, and cross-process interactions.
Drive defect reduction, process capability improvements, and cycle time reduction.
Lead integration activities for NPI, pilot builds, and ramp to high-volume manufacturing.
Own integration readiness criteria including process stability, control plans, and manufacturability.
Support cross-site technology transfer and process replication with strong change control discipline.
Develop and maintain integrated process flows, specifications, and control strategies.
Define critical process parameters, control points, and monitoring strategies (SPC/FDC).
Ensure robust process window characterization and documentation.
Analyze inline, electrical test, metrology, and defect data to identify integration gaps.
Design and execute complex DOEs to resolve multi-variable process interactions.
Utilize structured methodologies (DMAIC, 8D) for root cause analysis.
Mentor and guide junior and senior engineers on integration practices and problem solving.
Provide technical leadership on cross-functional and multi-site initiatives.
Influence long-term integration strategy and technology roadmap.