Sr. Product Development Engineer

Micron • Boise, ID

20h • Onsite

About The Position

Responsible for CPI related issues for Micron’s DRAM memory products from pathfinding through NPI start up into HVM. Establish package program plans for new DRAM fab technology process nodes specific to DRAM 3DS products, coordinate DRAM device/package/module end-to-end reviews. Fundamental understanding of key risks in Fab BEOL (Backend of Line), Fab memory array design/processes, wafer probe flows, wafer/device bumping & flip chip assembly technologies, package design, assembly processes, and materials & process interaction effects.

Requirements

• Master’s degree in Material Science Engineering, Chemical Engineering, Metallurgical Engineering, Electrical Engineering, Physics or related field
• 60 months of experience in the job offered or in an Engineering-related occupation

Responsibilities

• DRAM/NAND memory device structure and function
• Chip-package-interaction (CPI) which includes assembly process understanding & effects of assembly stresses, package design understanding and effects/influence of design decisions, and DRAM/NAND design/process influences
• DRAM/NAND device/package design files and incorporate device design features into CPI and packaging risk assessments
• DRAM/NAND memory device Wafer Probe and Test flows, including electrical data analysis and correlating electrical failures under various temperature and voltage conditions to CPI physical defects
• DRAM/NAND memory device fabrication knowledge, specifically including memory array and back-end-of-line fabrication processes
• DRAM/NAND CPI quality and reliability degradation mechanisms, intrinsic vs extrinsic defects, accelerated reliability stress tests, & sampling statistics to be able design effective quality and reliability qualification plans screening tests

Benefits

• choice of medical, dental and vision plans
• benefit programs that help protect your income if you are unable to work due to illness or injury
• paid family leave
• robust paid time-off program
• paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Senior