Sr Principal Process Development Engineer

FormFactor Inc.•Livermore, CA

8d•$136,200 - $178,815•Onsite

About The Position

FormFactor, Inc. (NASDAQ: FORM), is a leading provider of essential test and measurement technologies along the full semiconductor product life cycle — from characterization, modeling, reliability, and design de-bug, to qualification and test. Semiconductor companies rely upon FormFactor’s products and services to accelerate profitability by optimizing device performance and advancing yield knowledge. The company serves customers through its network of facilities in Asia, Europe, and North America. Rooted in our core values — Focus on the Customer, Ownership & Accountability, Respectfully & Effectively Communicate, and Motivate & Develop People — we foster an environment where diverse perspectives are not only welcomed but celebrated. Everyone can make an impact here. Whether it's improving products, supporting customers, or positively influencing peers and the community, the contributions of our people matter.

Requirements

Minimum of 8 years of related experience with a Bachelor’s degree; or 6 years and a Master’s degree; or a PhD with 3 years experience; or equivalent experience
Assembly Manufacturing
Assembly Operations
Integration Development
Perform Testing
Process Performance
Product Assembly
Test Analysis
Test Evaluation

Nice To Haves

Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Manufacturing Engineering, Materials Science, or related field.
3–7 years of SMT or PCB assembly experience (semiconductor, PCBA, or electronics assembly preferred).
Strong understanding of solder paste behavior, reflow principles, component placement strategies, and defect mechanisms.
Hands‑on experience with SMT equipment and inspection systems (SPI, AOI).
Proficiency with SPC, FMEA, DOE, and root cause problem solving.
Experience in probe card, semiconductor test hardware, or high‑precision PCB manufacturing.
Familiarity with high‑density BGAs, fine‑pitch components, and micro‑assembly.
Knowledge of CAM/EDA data for stencil/paste aperture optimization.
Lean/6σ Green Belt or Black Belt certification.
Experience with MES systems and factory automation.
Strong ownership mindset and ability to lead daily factory support.
Excellent troubleshooting skills and a structured approach to problem solving.
Ability to work cross‑functionally in a fast‑paced, high‑mix environment.
Clear communication and documentation discipline.
Passion for continuous improvement and operational excellence.

Responsibilities

Develop, qualify, and maintain SMT processes, solder paste selection, solder paste injection and inspection, reflow profiling, and placement parameters.
Own recipe creation and optimization for high‑density advanced probe card PCBs.
Drive process capability improvements (Cp/Cpk) and ensure stable production performance.
Provide daily engineering support for SMT equipment such as: Stencil printer, Pick‑and‑place machine, Reflow oven, SPI (Solder Paste Inspection).
Lead troubleshooting and root cause analysis for equipment failures, misplacements, reflow defects, or inspection inaccuracies.
Define and maintain PM schedules, calibration, and spare parts strategies.
Monitor and analyze yield, defect Paretos, and SPC trends to identify systemic issues.
Lead DfX (Design for Assembly, Design for Manufacturability) discussions with design engineering.
Implement corrective actions and sustainable process controls for solder bridging, opens, voiding, tombstoning, and wetting failures.
Support production technicians with process deviations, equipment issues, and new product introductions.
Develop documentation including WI/SOPs, process parameters, machine setup sheets, and inspection criteria.
Drive cycle time reduction, throughput improvements, and operator training.
Work closely with Plating & Metallization Engineers, Photolithography Engineers, Mechanical/Assembly Engineering, Electrical Test Engineering (FPT, PRVX4), Supply Chain & Quality.
Provide engineering support during prototype builds and customer‑specific configurations.
Lead Lean/6σ initiatives to reduce waste, improve flow, and enhance process robustness.
Evaluate and introduce new materials (solder paste, adhesives, fluxes) and improved stencil/hardware designs.
Participate in equipment justification and capital project planning.