Sr. Principal Hardware Engineer

Hewlett Packard Enterprise•Sunnyvale, CA
•$181,000 - $367,000•Onsite

About The Position

We are seeking a highly motivated and experienced Senior Hardware Design Engineer to join our team and lead the design and development of next-generation networking hardware. The ideal candidate is a hands-on engineer with 10+ years of experience in complex hardware board design and a proven track record of taking designs from initial concept through production. This role requires deep expertise in high-speed signaling, high-power and extremely dense PCB designs, FPGA development, signal integrity analysis, thermal management using liquid cooling, and mechanical design/integration. The successful candidate will thrive in a fast-paced environment, demonstrate exceptional technical ownership, and work collaboratively across hardware, firmware, software, mechanical, thermal, and manufacturing teams.

Requirements

  • 10+ years of hands-on hardware/board design experience with complex, high-performance electronic systems.
  • 10+ years with the below experience as well:
  • Experience designing high-speed systems with 100G/200G-class signaling or comparable high-bandwidth interfaces.
  • Experience designing high-power, extremely dense PCBs and electronic systems.
  • Hands-on experience with FPGA design, including the ability to independently design and implement FPGA-based solutions when required.
  • Strong knowledge of Signal Integrity and Power Integrity (SI/PI) principles.
  • Experience with scale-up systems and high-performance computing, networking, AI/ML, accelerator, or similarly demanding architectures.
  • Experience with liquid cooling systems, including the development of liquid-cooled hardware and system architectures.
  • Excellent communication and collaboration skills with a demonstrated ability to work effectively across multidisciplinary teams.

Nice To Haves

  • We are looking for an engineer who combines deep technical expertise with exceptional ownership and execution.
  • You should be comfortable operating at both the system-architecture level and the detailed board-design level.
  • You are a team player with high energy, extreme focus, and a strong sense of urgency.
  • You take ownership, are willing to dive deep into difficult technical problems, and consistently drive projects to completion.
  • You should be someone who can take an ambiguous problem, define the architecture, make the necessary engineering tradeoffs, execute the design, and ultimately deliver a production-ready system.
  • You understand that at extreme levels of performance and density, electrical, thermal, mechanical, and system architecture cannot be designed independently.
  • If you are excited by challenging hardware problems involving extreme bandwidth, power, density, thermal performance (liquid cooling), we want to hear from you.

Responsibilities

  • Own the end-to-end hardware design lifecycle, from system architecture and concept development through schematic design, PCB layout, bring-up, validation, qualification, and production.
  • Lead the design of high-performance, high-density, high-power circuit boards with demanding electrical, thermal, and mechanical constraints.
  • Design systems incorporating high-speed serial signaling and interconnects at 100G, 200G, and beyond.
  • Develop and review complex schematics, power architectures, clocking solutions, high-speed interfaces, and board-level architectures.
  • Design and develop FPGA solutions as required, including FPGA selection, device configuration, interfaces, implementation, bring-up, and hardware/firmware integration.
  • Perform and/or drive Signal Integrity (SI) and Power Integrity (PI) analysis
  • Work on liquid-cooled scale-up system architectures, including high-bandwidth, high-performance interconnects and systems requiring significant compute, power, and bandwidth density.
  • Collaborate with thermal and mechanical engineering teams on liquid cooling architectures, cold plates, manifolds, flow paths, thermal interfaces, and system-level thermal solutions.
  • Identify technical risks early and develop practical solutions to ensure successful execution against aggressive schedules.

Benefits

  • Health & Wellbeing
  • Personal & Professional Development
  • Unconditional Inclusion
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