Sr. Principal Engineer, Photonics Solutions

Intel Corporation•Santa Clara, CA

3d•$256,050 - $361,480•Onsite

About The Position

Intel Integrated Photonics Solutions (IPS) is a leader in silicon photonics integration and commercialization, known for its hybrid silicon laser technology and scalable manufacturing. The team's mission is to enable the next generation of data centers and AI infrastructure through advanced silicon photonics solutions, driving bandwidth growth and smaller form factors. This role involves leading the photonics product architecture for silicon photonics AI connectivity solutions, focusing on Optical Computer Interconnect (OCI) and Co-Packaged Optics (CPO) die-stack solutions. The Senior Principal Engineer will drive the delivery of photonics solutions aligned with the technical vision for next-generation AI infrastructure connectivity, collaborating with cross-functional teams to deliver breakthrough photonic products for AI compute scaling. The position offers opportunities to design AI connectivity solutions by defining system-level product architectures, drive strategic technology roadmaps for Intel's Silicon Photonics strategy for AI infrastructure, lead technical excellence across domains by integrating photonic components, electronic interfaces, thermal management, packaging, and AI system requirements, and pioneer next-generation solutions by developing novel architectures including 112Gbaud+ connectivity, advanced multi-wavelength systems, and innovative packaging for AI workloads.

Requirements

PhD in Electrical Engineering, Physics, Optical Engineering, or similar discipline with 8+ years of experience in a related field and 8+ years of relevant industry experience
8+ years of experience in silicon photonics system architecture and integration from concept to high volume manufacturing
Extensive (10+ years) experience in designing and architecting photonic systems for high-performance computing or AI applications
Proven track record of leading complex, multi-disciplinary technical programs involving photonic systems
Deep expertise in optical interconnect architecture
Strong background in AI/ML infrastructure requirements and compute interconnect scaling challenges
Experience with system-level modeling and/or performance optimization for high-bandwidth optical links
Demonstrated technical leadership experience directing the work of senior engineering teams
Cross-functional collaboration skills: working with AI hardware, process, test, packaging, and applications teams
Executive communication abilities: presenting strategic technical vision to senior leadership and external partners
Strategic problem-solving mindset: demonstrated ability to architect solutions for complex system-level challenges

Nice To Haves

Technical leadership experience: leading large, multi-site engineering organizations
Deep experience with AI training and inference infrastructure requirements (GPU clusters, distributed computing)
Knowledge of advanced packaging technologies for high-density optical interconnects
Experience with industry standards development (OIF, IEEE, OCP) for optical interconnects
Familiarity with foundry/fab ecosystems and supply chain management for photonic solutions
Publications in peer-reviewed journals on optical interconnects or AI infrastructure
Customer-facing experience with hyperscale data center operators and AI companies
Exposure to: advanced modulation formats, wavelength division multiplexing (WDM), optical switching architectures, thermal management for high-density optics
Experience with co-design methodologies linking photonic hardware with AI software stacks
Knowledge of emerging technologies: linear-drive modulators, advanced detector arrays, optical switching matrices

Responsibilities

Lead the overarching photonics product architecture for silicon photonics AI connectivity solutions, with particular focus on Optical Computer Interconnect (OCI) and Co-Packaged Optics (CPO) die-stack solutions.
Drive delivery of photonics solutions meeting the strategic technical vision for next-generation AI infrastructure connectivity.
Work with cross-functional teams to deliver breakthrough photonic products that enable massive AI compute scaling.
Design AI connectivity solutions by defining system-level product architectures that enable unprecedented AI compute density and performance.
Drive strategic technology roadmaps by engaging in Intel's Silicon Photonics strategy for AI infrastructure.
Lead technical excellence across domains by orchestrating seamless integration between photonic components, electronic interfaces, thermal management, packaging and AI system requirements.
Spearhead development of novel architectures including 112Gbaud+ connectivity, advanced multi-wavelength systems, and innovative packaging approaches for AI workloads.