Sr. Principal Engineer, Manufacturing Infrastructure

Marvell Technology•Santa Clara, CA

8d•$158,600 - $234,650

About The Position

The Advanced Technology Infrastructure team operates as a specialized pathfinding group, developing the automated test architectures and technology roadmaps required to transition Marvell’s next-generation silicon into high-volume production. We focus on the research and development of solutions for the critical power, thermal, and mechanical challenges of high-density chips and advanced optical technologies. In this role, you will drive the technology development that enables AI-scale networking, directly influencing how the world’s most complex hardware is architected for reliability and performance. We are seeking a Sr. Principal Engineer, Manufacturing Infrastructure to join our Advanced Technology Infrastructure team. This role is instrumental in pathfinding and developing next-generation test and manufacturing infrastructure across all Marvell products, including advanced multi-chip module (MCM) custom silicon, high-density silicon photonics, and co-packaged optics/copper (CPO/CPC) architectures. You will lead the program execution and delivery of robust infrastructure solutions, serving as the technical bridge between Design, Packaging, Operations, and Quality teams to ensure the seamless transition of innovative concepts from the lab to High-Volume Manufacturing (HVM).

Requirements

Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Physics or equivalent and 15+ years of relevant experience.
Strong diversified background with expertise in Product Engineering, Mechanical Design, and Systems Integration for high-speed custom silicon and advanced packaging.
Prior experience in the development and validation of solutions testing silicon photonics, photonic interposers, and high-speed interconnect architectures.
Demonstrated success in executing technology transfers from R&D to HVM environments, including handover to global Operations and Quality teams.
Mastery of project management tools and methodologies specifically tailored for complex hardware and infrastructure development cycles.
Experience in customer-facing technical roles with a proven ability to translate external requirements into internal engineering roadmaps.
Deep industry knowledge as a continuous learner who is knowledgeable in the latest semiconductor and photonics trends and industry shifts.
Exceptional ability to influence and lead cross-functional teams and drive consensus across Design, Packaging, Operations, and Finance organizations.

Responsibilities

Orchestrate end-to-end integration and delivery of complex infrastructure programs, enforcing development schedules and performance targets to ensure successful on-time technology transition to HVM teams.
Drive technical milestones for new test hardware development, with a special focus on the deployment of Known Good Die (KGD), Co-Packaged Optics (CPO), and Co-Packaged Copper (CPC) solutions.
Act as a central integration point between specialized Thermal, Mechanical, Photonic, and Signal Integrity/Power Integrity teams as the primary lead to deliver unified, high-performance hardware and test solutions.
Collaborate with cross-functional teams across Design, Packaging, Operations, and Quality organizations to align new infrastructure capabilities with future product requirements.
Capture and translate customer future roadmaps and specifications into actionable internal engineering roadmaps and technology readiness schedules.
Strengthen new and existing partner relationships and jointly drive long-term technical roadmaps for manufacturing and test hardware to ensure Operations readiness for rapid scaling requirements.
Drive transfer-to-manufacturing protocols, evaluating and qualifying new partners and managing the global deployment of test architectures from wafer sort through system-level test.
Own comprehensive project schedules, track critical path deliverables, and proactively implement risk mitigation frameworks.
Represent advancements at industry conferences and technical forums to communicate Marvell infrastructure vision and technical leadership.
Monitor industry trends in advanced packaging, photonics, and high-speed signaling to ensure internal manufacturing infrastructure remains at the cutting edge.
Optimize solutions for manufacturing yield, repeatability, and throughput by providing direct technical feedback on mechanical, thermal, photonic, signal integrity, and power integrity performance on test vehicles.