Sr. Mechanical Engineer

Lockheed Martin•Moorestown, NJ

1d•Hybrid

About The Position

As a part of the Lockheed Martin community, we take on challenges and find solutions using creativity and collaboration. If you’re looking to be a part of a passionate team solving these complex problems, then Rotary and Mission Systems is the place for you. We are seeking a Sr. Mechanical Engineer to join the RF & Microwave Packaging & Analysis group in the Sensor Mechanical Design Center. In this role, the selected candidate will work as part of an engineering team to develop electro-mechanical packaging concepts for elements of large scale radars or airborne systems. This candidate will interface with Systems, Electrical Engineers, Drafting and Operations personnel in the development of detailed packaging designs and assembly strategies. The candidate will also work on advanced microelectronics technologies in support of low-SWaP (Size Weight, and Power) solutions to meet Lockheed Martin sensor and mission needs. The selected candidate will work closely with cross-functional teams in the design, development, integration, and testing and requirements verification of these technologies, including the support of technical data packages, design reviews, supplier engagement, and lab & test facility activities. Position is located in Moorestown, NJ.

Requirements

Bachelor's degree or higher in Mechanical Engineering
Minimum 5 years professional experience
Experience supporting multi-disciplinary engineering teams
Proficiency with 3D Computer Aided Design (CAD) Software such as Solidworks or Creo.
Ability to obtain & maintain a U.S. DoD clearance at the SECRET level.
U.S. Citizenship required

Nice To Haves

Master's degree in mechanical engineering
Structural / Thermal Analysis experience with ANSYS Finite Element Analysis (FEA) or compatible tool
PWB/CCA and electronics packaging experience
Designing electronics for military environments
Familiarity with Geometric Dimensioning and Tolerance (GD&T)
Familiarity with design for manufacturing
BOM and configuration management preferably using Windchill or compatible tool

Responsibilities

Develop electro-mechanical packaging concepts for elements of large scale radars or airborne systems.
Interface with Systems, Electrical Engineers, Drafting and Operations personnel in the development of detailed packaging designs and assembly strategies.
Work on advanced microelectronics technologies in support of low-SWaP (Size Weight, and Power) solutions to meet Lockheed Martin sensor and mission needs.
Work closely with cross-functional teams in the design, development, integration, and testing and requirements verification of these technologies.
Support of technical data packages, design reviews, supplier engagement, and lab & test facility activities.