Sr. Manager Packaging Engineering
About The Position
Help turn “possibility” into “reality” by leading the design execution of next-generation Data Center GPU and MI programs. This role represents a critical leadership position responsible for delivering high-performance, high-complexity package designs in a fast-paced environment. In this role you will lead cross-functional teams across design, Signal/Power Integrity, substrate vendors, OSAT partners, and program management to ensure successful execution of multiple concurrent programs. You will drive operational excellence, scale execution using automation and AI-enabled methodologies, and deliver best-in-class package solutions that meet aggressive timelines and technical requirements.
Requirements
- Excellent program management and leadership skills.
- Ability to work with global cross functional teams in a fast paced environment.
- Ability to excel at influencing.
- B.S. or higher in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field.
Nice To Haves
- Experience in semiconductor package design, with strong focus on high-performance or data center products.
- Proven experience leading teams and executing multiple concurrent complex projects in fast-paced environments.
- Strong understanding of package layout, high-speed design considerations, and multi-die integration.
- Experience with AI/ML applications in engineering workflows (design automation, data analytics, optimization).
- Excellent leadership, communication, and stakeholder management skills.
- Demonstrated ability to handle ambiguity, drive decisions, and deliver under pressure.
- Experience working with OSATs, substrate vendors, and manufacturing partners.
- Hands-on experience with industry tools such as Synopsys 3DICC, Cadence SiP / APD or equivalent.
- Experience in Data Center GPU, HPC, or advanced packaging technologies (e.g., chiplets, 2.5D/3D integration).
Responsibilities
- Lead end-to-end execution of multiple Data Center GPU / MI package design programs, ensuring schedule, quality, and cost targets are consistently met.
- Drive execution in fast-paced, dynamic, and high-pressure environments, managing competing priorities across programs.
- Establish and maintain robust execution frameworks, including milestone tracking, risk management, and readiness gates.
- Interface with senior leadership to provide clear program status, risks, and mitigation strategies.
- Lead, mentor, and grow a high-performing team of package design engineers across geographies.
- Foster a culture of accountability, innovation, and continuous improvement aligned with AMD engineering excellence.
- Conduct performance reviews, talent development planning, and succession management.
- Collaborate with silicon, SI/PI, thermal, mechanical, and manufacturing teams to ensure design convergence.
- Engage with OSAT and substrate vendors to drive design feasibility, manufacturability, and yield optimization.
- Define and drive improved design methodologies, workflows, and best practices to enhance execution efficiency.
- Champion adoption of AI/ML-enabled tools and automation (e.g., layout optimization, design rule checking, predictive analytics) to improve productivity and decision-making.
- Scale digital transformation initiatives within the package design organization.
Benefits
- AMD benefits at a glance
Stand Out From the Crowd
Upload your resume and get instant feedback on how well it matches this job.
What This Job Offers
Job Type
Full-time
Career Level
Manager
