Sr. Incoming Quality Inspector

Analog Devices•Chelmsford, MA

1d•Onsite

About The Position

Inspectors work to support RF microelectronics-manufacturing team by performing inspection of highly complex modules. Must have the ability to work on a wide range of commodities including semiconductors, COTs parts, machined housings, printed circuits boards, PCBAs, and discretes. The candidate receives training from their colleagues and engineering staff and must demonstrate attainment of necessary skills to become a Quality Inspector. The work assignments will include several of the following operations: Visual Inspections, which shall include but not limited to, precap, final, MMIC and wire bond inspections along with proper Data Entry Documentation Review Mechanical Dimensions Ability to accurately read and interpret prints/Source Control Drawings (SCDs) Familiarity with the following MIL-STDs and IPC Standards: Printed Circuit Assembly Solder inspection to IPC-A-610 Low & High-Power Visual Inspection to MIL-STD-883, Method 2010 Hybrid Internal Visual Inspection to MIL-STD-883, Method 2017 Printed Circuit Inspection to IPC-A-600 Package Inspection to MIL-STD-883, Method 2009 Die Shear Testing to MIL-STD-883, Method 2019 Wire bond Testing to MIL-STD-883, Method 2011 and 2023

Requirements

US CITIZENSHIP
High School Diploma
Microelectronics Training/Experience
Optical Microscopy Inspection
Bond Pull/Die Shear Gauge
Go/No-Go gauges
Walking = 30%
Constant sitting = 70%
Lifting up to 25 lbs. – Floor to waist then back to the floor
Lifting up to 10 lbs. – Waist to chest
Lift and Carry up to 10 lbs. – Floor to waist

Nice To Haves

SAP ERP systems experience
EMPOWER Document Control database

Responsibilities

Performing inspection of highly complex modules.
Visual Inspections, including precap, final, MMIC and wire bond inspections.
Data Entry Documentation Review.
Mechanical Dimensions.
Ability to accurately read and interpret prints/Source Control Drawings (SCDs).
Familiarity with MIL-STDs and IPC Standards for various inspections (Printed Circuit Assembly Solder, Low & High-Power Visual, Hybrid Internal Visual, Printed Circuit, Package Inspection, Die Shear Testing, Wire bond Testing).