Sr. Equipment Engineer Etch Job#0997

TSMC•Phoenix, AZ

7d•Onsite

About The Position

TSMC Arizona is developing advanced semiconductor fabrication facilities. The first fab will use N4 process technology, with production beginning in the first half of 2025; the second fab will use N3 and N2 technology and is expected to be operational in 2028; and a third fab is planned to manufacture chips using 2nm or more advanced technology by the end of the decade. The Sr. Equipment Engineer - Etch improves equipment performance and availability for semiconductor equipment in a cleanroom environment and installs and qualifies new tool sets according to planned schedules to add capacity. The role focuses on etch equipment and requires working on-site at TSMC’s Phoenix, Arizona facility. The standard schedule is 40 hours per week, Monday through Friday, 8:30 a.m. to 5:30 p.m. Multiple positions are available.

Requirements

Bachelor’s degree in Electronics Engineering, Electrical Engineering, Mechanical Engineering, Automation Engineering, or a related field.
At least 2 years of experience in an engineering role.
Education or experience with semiconductor manufacturing principles, practices, and techniques related to equipment engineering and maintenance.
Education or experience with 5nm-or-beyond technology in the logic-chip semiconductor industry.
Education or experience in dry etching processing.
Education or experience with Tokyo Electron Ltd. (TEL) F1000/FrepCC/Leaga and Applied Materials (AMAT) Sym3/SRP and LAM Research Flex FL/Kiyo FX/Argos tool models.
Education or experience performing preventive maintenance and troubleshooting on Lam Research Flex FL/Kiyo FX/Argos tools.
Completion of a full facility installation process for a LAM etching tool.
Must be willing and able to work on-site at the Phoenix, Arizona facility.

Responsibilities

Resolve critical equipment issues to improve tool uptime, availability, and utilization efficiency.
Identify and pursue hardware capability enhancements to reduce defects.
Drive root-cause and corrective-action analysis for process escalations.
Install and qualify new tool sets for 5-nanometer or beyond equipment according to planned schedules and meet process release standards.
Communicate with cross-functional engineers and vendors, and serve as a module liaison with facilities, vendors, and manufacturing shift personnel.