Sr. Equipment Engineer CMP (Mult. Pos.) - Job# 5381

TSMC•Phoenix, AZ

1d•Onsite

About The Position

A job at TSMC Arizona offers an opportunity to work at the most advanced semiconductor fab in the United States. TSMC Arizona’s first fab will operate its leading-edge semiconductor process technology (N4 process), starting production in the first half of 2025. The second fab will utilize its leading edge N3 and N2 process technology and be operational in 2028. The recently announced third fab will manufacture chips using 2nm or even more advanced process technology, with production starting by the end of the decade. America’s leading technology companies are ready to rely on TSMC Arizona for the next generations of chips that will power the digital future. As a Sr. Equipment Engineer – CMP, you will demonstrate a strong sense of reliability and enthusiasm and will possess an attitude that embodies our core values – Integrity, Commitment, Innovation, and Customer Trust. Multiple positions available. Improve tool performance and availability for diffusion, thin film, lithography or etching equipment in a clean room environment. Install and qualify new tool sets according to planned schedules, to add capacity in a timely manner.

Requirements

Master’s degree or foreign equivalent in Electronics Engineering, Electrical Engineering, Mechanical Engineering, Material Science, Chemical Engineering, Automation Engineering or a related field, plus 1 year of experience in an engineering role. Alternatively, Bachelor’s degree or foreign equivalent in Electronics Engineering, Electrical Engineering, Mechanical Engineering, Material Science, Chemical Engineering, Automation Engineering or a related field, plus 3 years of experience in an engineering role.
One (1) year experience with semiconductor manufacturing principles, practices and techniques as they relate to equipment engineering and maintenance.
One (1) year of experience in the following 5nm technology or beyond in logic chip semiconductor industry: 5nm or more advanced tools maintenance, including preventive maintenance, troubleshooting, and equipment improvement; 5nm or more advanced tools qualifications and continue improvement project for tool ready to production.
Education or experience in the following: data analysis, and components and equipment selection; CMP basic principles and semiconductor manufacturing processes, capable of adjusting equipment parameters based on process requirements, with the ability to analyze and diagnose wafer surface defects (such as scratches and residues) and material removal rates; and specialized CMP equipment control interfaces and operating software, with basic operation and maintenance skills for robotic arms.
One (1) year experience in at least 2 of the following software: C++; Python; UNIX; Creo 3D CAD; Pro-E; AutoCAD; MATLAB; COMSOL; OrCAD; or Solidworks.
Willing and able to work on-site at our Phoenix Arizona facility.

Responsibilities

Solve critical equipment issues, improving tool uptime availability and utilization efficiency.
Identify and pursue opportunities for hardware capability enhancement, driving defect reduction.
Drive root causes and corrective action analysis on process escalations.
Install and qualify new tool sets for the 5- nanometer or beyond equipment according to planned schedules and meet the process released standard.
Communicate with cross-function engineers or vendors, and serve as a module liaison with facilities, vendor, and manufacturing shift personnel.