Sr Engineer, Failure Analysis Engg (Manufacturing/Quality)

Analog Devices•Wilmington, MA

1d•$171,787 - $180,810•Onsite

About The Position

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X. This role is responsible for the overall health of the products under Microelectromechanical Sensors (MEMS) and Inertial Measurement Units (IMU), including Failure Analysis support for issue resolution, quality/yield improvements, and technique development. The engineer will collaborate with design, test, product, and quality engineering teams to identify failure mechanisms and recommend corrective actions. Support will be provided for customer returns, reliability assessments, and qualification efforts. The role involves leading and executing failure analysis activities on semiconductor devices and systems, including electrical, physical, mechanical, and environmental failures. A key aspect of this position is to drive continuous improvement in failure analysis methodologies and lab capabilities. The engineer will also develop and support failure analysis documentation, including reports, presentations, and technical summaries, and mentor junior engineers while contributing to knowledge sharing across the team.

Requirements

Bachelor’s degree in Electronics Engineering, Electrical Engineering, Materials Science, Physics, or related field (willing to accept foreign education equivalent)
Five (5) years of experience in failure analysis or reliability engineering in the semiconductor or electronics industry.
Demonstrated Expertise (“DE”) performing evaluation and characterization using bench test equipment including signal generators, spectrum analyzers, oscilloscopes, and power meters controlled and automated by Python, LabView, and Zero Code GUI
DE with analog and mixed-signal ICs, MEMS sensors, IMU or automotive-grade components
DE performing mixed integrated circuit (IC) and modeling and simulation using Cadence and Avalon
DE performing failure analysis of analog and mixed signal integrated circuits by conducting fault isolation using techniques including OBIRCH, EMMI, TDR, X-Ray and Thermal Hotspot and leveraging principles of semiconductor device physics and transistor level analog circuit
DE performing mechanical and chemical de-processing, parallel polishing, utilizing high-resolution scanning electron microscope (SEM) and focused ion beam (FIB) and related techniques including passive voltage contrast (PVC), Energy-dispersive X-ray spectroscopy (EDX), and in-situ nanoprobing to characterize and interpret the microstructure and material properties of the semiconductor device.

Responsibilities

Responsible for the overall health of the products under Microelectromechanical Sensors (MEMS) and Inertial Measurement Units (IMU), including Failure Analysis support for issue resolution, quality/yield improvements, and technique development.
Collaborate with design, test, product, and quality engineering teams to identify failure mechanisms and recommend corrective actions.
Support customer returns, reliability assessments, and qualification efforts.
Lead and execute failure analysis activities on semiconductor devices and systems, including electrical, physical, mechanical, and environmental failures.
Drive continuous improvement in failure analysis methodologies and lab capabilities.
Develop and support failure analysis documentation, including reports, presentations, and technical summaries.
Mentor junior engineers and contribute to knowledge sharing across the team.