Sr. Electrical Design Engineer III

TEKsystems•Kirkland, WA

1d•$65 - $70•Onsite

About The Position

This is a contract position for two electrical engineer roles, one with a digital and high-speed design focus, and the other with a power design focus. Both roles involve end-to-end ownership from design through schematic capture, component selection, signal integrity analysis, board bring-up, validation, and debugging in the lab. Experience with Siemens Xpedition EDM tools is strongly preferred for both positions. The digital role focuses on processor/FPGA/SoC-based boards, high-speed interfaces, and debugging complex digital systems. The power role focuses on defining power architecture, designing DC-DC converters and LDOs, power distribution networks, and power sequencing for FPGA/SoC, memory, and peripheral loads. Both roles require strong fundamentals, hands-on lab proficiency, and the ability to document results and drive root-cause analysis. Success in these roles requires comfort with ambiguity, a strong debugging aptitude, and rigorous documentation and communication skills.

Requirements

Bachelor's degree in Electrical Engineering (or equivalent) and hands-on digital hardware design experience.
Demonstrated ownership of a complex digital board from schematic through bring-up and validation.
Strong high-speed digital design fundamentals.
Experience with high-speed memory and/or high-speed serial interfaces.
Proficiency with industry-standard schematic capture and PCB (EDM) design tools. Siemens Xpeditions tool chain experience is strongly preferred.
Hands-on lab proficiency with high-speed test equipment and a structured debug methodology.
Ability to read datasheets, reference manuals, and user guides and turn them into correct design decisions.
Bachelor's degree in Electrical Engineering (or equivalent) and hands-on power/hardware design experience.
Demonstrated ownership of a multi-rail board power design from schematic through bring-up and characterization.
Strong fundamentals in switching and linear regulator design, magnetics selection, and control-loop/stability basics.
Practical PDN and power-integrity experience.
Experience with power sequencing, supervisors, load switches, inrush, UVLO/OVP/OCP protection.
Proficiency with schematic capture and PCB design using Xpedition or similar EDM tools (e.g. Siemens Xpedition/EDM, Cadence, Altium).
Hands-on lab proficiency: power analyzers, electronic loads, oscilloscope, DMM, and a structured debug methodology.
Ability to read datasheets and device power specs and turn them into a correct, robust power tree.

Nice To Haves

Experience with processor/FPGA/SoC-based hardware design and associated toolchains.
High-speed memory or serial-interface design and bring-up experience.
Signal-integrity simulation experience.
Experience bringing up embedded processors/SoCs and working alongside firmware/software.
High-reliability or harsh-environment design experience.
Scripting for test automation and data analysis.
Power delivery for FPGAs/SoCs including core, transceiver-analog, and memory rails.
Power-integrity simulation experience (Sigrity/PowerSI, HyperLynx, ANSYS, or similar).
Battery/solar or spacecraft power-system exposure; radiation-aware or high-reliability power design.
Thermal analysis and co-design with mechanical teams.
Scripting for test automation and data analysis (Python or similar).

Responsibilities

Design complex multi-layer digital PCBs: schematic capture, component selection, and design reviews for processor/FPGA/SoC-based boards.
Define and constrain high-speed digital interfaces, including pin planning and interface budgeting.
Own clocking, resets, boot/configuration, and general-purpose I/O for the digital subsystem.
Perform signal-integrity analysis (pre- and post-layout) and translate results into routing and impedance constraints with layout.
Partner with layout on routing of dense, high-pin-count devices.
Own digital bring-up: power-on hand-off, clocking, interface initialization, and link validation.
Debug in the lab using appropriate high-speed instrumentation and a structured methodology.
Write and execute functional and interface test plans across operating conditions; document results and drive root-cause of failures.
Support hardware/firmware/software integration and debug.
Contribute to manufacturing readiness: design-for-manufacturability/test, bring-up procedures, and documentation.
Define the board power architecture: rail planning, budgeting, sequencing, and power-state/mode design for FPGA/SoC, memory, and peripheral loads.
Design DC-DC converters (buck/multiphase), LDOs, load switches; select components and run margin/derating analysis.
Design and analyze the power distribution network.
Own power sequencing and supervision.
Own power bring-up in the lab.
Debug and characterize supplies using power analyzers, electronic loads, oscilloscopes, and thermal tools.
Write and execute power test plans across voltage and temperature; document results and drive root-cause of power-related failures.
Contribute to manufacturing readiness: DFM/DFT for power circuits, bring-up procedures, and test documentation.