Micron Technology is a world leader in innovating memory and storage solutions. The Heterogeneous Integration Group (HIG) is developing High Bandwidth Memory (HBM) solutions for AI and ML applications by stacking multiple DRAM chips on a high-speed memory controller using TSV technology. This role involves contributing to modular, scalable verification solutions for next-generation HBM DRAM products. The engineer will work independently within a multi-functional team, collaborating with Design Engineering, Product Engineering, and Business Units to complete the HBM verification roadmap. The position requires applying knowledge of testbench architecture, verification methodologies, and 2.5D & 3D package integration.
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Job Type
Full-time
Career Level
Senior