Cloud Hardware Development, Packaging, Network Product Development - Optics

Amazon • Cupertino, CA

1d

About The Position

AWS Infrastructure Services owns the design, planning, delivery, and operation
of all AWS global infrastructure. In other words, we're the people who keep the
cloud running. We support all AWS data centers and all of the servers, storage,
networking, power, and cooling equipment that ensure our customers have
continual access to the innovation they rely on. We work on the most challenging
problems, with thousands of variables impacting the supply chain — and we're
looking for talented people who want to help.

You'll join a diverse team of software, hardware, and network engineers, supply
chain specialists, security experts, operations managers, and other vital roles.
You'll collaborate with people across AWS to help us deliver the highest
standards for safety and security while providing seemingly infinite capacity at
the lowest possible cost for our customers. And you'll experience an inclusive
culture that welcomes bold ideas and empowers you to own them to completion.

We are looking for a Sr. Cloud Hardware Development Engineer (CHDE) with
packaging expertise to join our Network Product Development (NPD) team. In this
role, you will enable the components that form the backbone of AWS network
interconnect. You will perform high-quality design, development, validation, and
sustaining engineering of IC and SOC packages for high-speed applications,
working closely with design teams, manufacturing partners, and cross-functional
stakeholders to deliver robust solutions at scale.

Packaging hardware development engineer (CHDE) perform high quality design,
development, validation, deployment, and sustaining engineering of integrated
circuit (IC) and system on chiop (SOC) packages for high-speed applications for
AWS network. They work closely with design teams, manufacturing partners, and
cross-functional stakeholders to deliver robust packaging and integated
solutions.

On an everyday basis as part of our team, you have the unique opportunity to
understand the growing AWS network and our internal customers’ requirement on
interconnect solutions and their components. You'll work backwards to devise
hardware solutions by influencing the broad industry and/or to develop software
tools with sister teams to maintain a highly available network that delights AWS
customers. You design and implement processes and mechanisms that both help the
team to deliver business impact to the organization in a systemic way, while
also helping to raise the bar on our operational excellence.
Operating at the scale we do, there is no blueprint for how to do what we do,
which encourages our engineers to identify and develop simple solutions to
complex problems. We encourage durable solutions that look around corners while
taking into consideration our customer needs from a cost, performance, and
reliability perspective.

Within AWS Networking the NPD (Network Product Development) organization is
responsible for, designing the hardware, building the software, and owning the
interconnects for the routers that power the global AWS network. Beyond product
delivery we actively manage the fleet or routers in a network that grows by 70%
annually. This means tracking key business and operational metrics to ensure
that we operate smoothly and minimize or eliminate customer impact due to device
related issues for a transparent AWS customer experience.

Requirements

• 1+ years of automation scripting using Python, Bash, Shell and/or Perl experience
• Bachelor's degree or above in mechanical engineering, electrical engineering, materials science, or physics
• 8+ years of work experience on IC/SOC packaging design, development, or validation
• 8+ years of experience with high-speed signal integrity principles, transmission line theory, and package electrical modeling
• 4+ years of experience developing test scripts and automation for package validation and characterization
• 2+ years of experience working with IC/SOC packaging suppliers, substrate manufacturers, assembly houses, and qualification processes

Nice To Haves

• Ph.D. in mechanical engineering, electrical engineering, material science, physics or equivalent
• In depth expertise in IC/SOC package design including mechanical stress analysis, thermal management, and reliability engineering
• Expertise in debugging and troubleshooting package-level failures and signal integrity issues
• Experience working with OSAT (Outsourced Semiconductor Assembly and Test) and substrate suppliers
• Experience in the semiconductor product development lifecycle
• Ability to innovate or invent packaging solutions to meet performance, cost, and reliability requirements

Responsibilities

• Collaborate with vendors/manufacturers to evaluate new packaging technologies (IC and SOC), materials, and assembly processes. Create implementation plans for incorporating them into product roadmaps.
• Develop and automate test plans for package characterization including signal integrity, power integrity, thermal performance, and mechanical reliability.
• Collaborate with vendors/manufacturers in defining and developing test plans for IC/SOC packages, substrates, and interconnect technologies.
• Work with operations teams in identifying quality issues, improving manufacturing yields, and optimizing RMA processes for packaged components.

Benefits

• health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level